公开(公告)号：US20180117889A1

公开(公告)日：2018-05-03

申请号：US15560615

申请日：2016-02-29

Applicant: RIKEN TECHNOS CORPORATION

Inventor： Ryota NAKANISHI ,  Kosuke SUGIYA

IPC: B32B27/32 ,  B32B27/08 ,  B32B15/085 ,  C09J153/02 ,  C09J145/00

CPC classification number: B32B27/32 ,  B32B15/085 ,  B32B27/00 ,  B32B27/08 ,  C08F8/46 ,  C08F255/02 ,  C08F287/00 ,  C08K5/14 ,  C08K5/1539 ,  C08L23/0823 ,  C08L53/025 ,  C09J123/0823 ,  C09J145/00 ,  C09J153/02 ,  C09J153/025 ,  C09J4/06 ,  C08F222/06

Abstract: Provided is a thermoplastic resin composition or an adhesive coating material capable of adhering a cyclic polyolefin-based polymer with a metal or metal compound such as aluminum foil or an ethylene-vinyl alcohol copolymer with sufficient strength. The thermoplastic resin composition contains (A) 100 parts by mass of thermoplastic resin; (B) 0.05 to 5 parts by mass of one or more kinds selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid derivative; and (C) 0.01 to 3 parts by mass of organic peroxide; which component (A) contains (a1) 10 to 90% by mass cyclic polyolefin-based polymer; and (a2) 90 to 10% by mass a hydrogenated product of a block copolymer comprising a polymer block composed mainly of an aromatic vinyl compound and a random copolymer block of a conjugated diene compound and an aromatic vinyl compound (with the proviso that the total of the component (a1) and the component (a2) is 100% by mass).

公开(公告)号：US20210317339A1

公开(公告)日：2021-10-14

申请号：US17272433

申请日：2019-08-13

Applicant: RIKEN TECHNOS CORPORATION

Inventor： Kosuke SUGIYA ,  Yoshihiro ZENNYOJI

IPC: C09J7/35 ,  C09J7/24 ,  C09J153/02 ,  C09J109/06 ,  H01B7/08

Abstract: A hot-melt adhesive for reinforcing a conductor terminal of a flexible flat cable, said hot-melt adhesive comprising at least one member selected from the group consisting of (P1) a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, wherein the content of a structural unit derived from the aromatic vinyl compound is not more than 65 mass % relative to the sum of the content of the structural unit derived from the aromatic vinyl compound and the content of a structural unit derived from the conjugated diene compound, (P2) a hydrogenated product of a random copolymer of an aromatic vinyl compound and a conjugated diene compound, (P3) an acid-modified hydrogenated product of a copolymer of an aromatic vinyl compound and a conjugated diene compound, and (P4) an amine-modified hydrogenated product of a copolymer of an aromatic vinyl compound and a conjugated diene compound; and a reinforcing tape wherein a layer of the hot-melt adhesive is formed on one surface of an insulating film.