Abstract:
A hot-melt adhesive for reinforcing a conductor terminal of a flexible flat cable, said hot-melt adhesive comprising at least one member selected from the group consisting of (P1) a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, wherein the content of a structural unit derived from the aromatic vinyl compound is not more than 65 mass % relative to the sum of the content of the structural unit derived from the aromatic vinyl compound and the content of a structural unit derived from the conjugated diene compound, (P2) a hydrogenated product of a random copolymer of an aromatic vinyl compound and a conjugated diene compound, (P3) an acid-modified hydrogenated product of a copolymer of an aromatic vinyl compound and a conjugated diene compound, and (P4) an amine-modified hydrogenated product of a copolymer of an aromatic vinyl compound and a conjugated diene compound; and a reinforcing tape wherein a layer of the hot-melt adhesive is formed on one surface of an insulating film.
Abstract:
A resin composition is provided for an adhesive layer of a laminate, the resin composition, containing: (A) 55 to 85 mass % of an acid modified polypropylene-based resin; and (B) 45 to 15 mass % of a copolymer of ethylene and one or more comonomers selected from the group consisting of vinyl acetate, an alkyl methacrylate, and an alkyl acrylate; in which the total of the component (A) and the component (B) is 100 mass %; and in which an acid modified amount of the component (A) is 0.5 to 10 mol %.
Abstract:
Provided is adhesive resin compositions comprising (A) 30 to 70% by mass of an acid-modified polypropylene-based resin; (B) 20 to 60% by mass of a polypropylene-based resin; and (C) 2 to 20% by mass of a copolymer of ethylene and one or more kinds of comonomers selected from the group consisting of vinyl acetate, alkyl methacrylate, and alkyl acrylate, with the proviso that the sum of the percentages of the above component (A), the above component (B), and the above component (C) is 100% by mass.
Abstract:
Embodiments of the invention relate to a poly(meth)acrylimide film and a method for manufacturing such a film. At least one embodiment provides a poly(meth)acrylimide film that has (i) a total light transmittance of over 90% and (ii) haze of 2.0% or less. This film preferably has retardation of less than 50 nm. The method for manufacturing this film includes the following steps: (A) using a device provided with an extruder and a T die, a poly(meth)acrylimide molten film is continuously extruded from the T die; and (B) the poly(meth)acrylimide molten film is loaded by being fed between a rotating or circulating first mirrored-surface body and a rotating or circulating second mirrored-surface body, and then the film is pressed. During these steps, (C) the surface temperature of the first mirrored-surface body is in the range 100-200° C., and (D) the surface temperature of the second mirrored-surface body is in the range 20-200° C.