Abstract:
PROBLEM TO BE SOLVED: To provide a capacitance type pressure probe or sensor for use at high temperature.SOLUTION: The capacitance type pressure sensor 100 includes a sapphire diaphragm 42 which is arranged in an internal detection chamber 30 of a probe housing, and has a first electrode 52 formed on a center part of the diaphragm 42. The center part of the diaphragm 42 and the first electrode 52 are adapted and configured to bend reacting to encountered pressure variation in the internal detection chamber 30 and through the pressure sensor 100. A sapphire substrate 46 having a second electrode 54 formed thereupon is fused to the sapphire diaphragm 42 mainly around a periphery thereof so as to form a sapphire stack and define a reference chamber 80 between the sapphire substrate 46 and the sapphire diaphragm 42. Before the sapphire diaphragm 42 is fused to the sapphire substrate 46, all contact surfaces are chemically treated and prepared using plasma excitation so as to form a bonding stack and lower the temperature needed for the fusion.
Abstract:
PROBLEM TO BE SOLVED: To provide a pendulous accelerometer with balanced gas damping. SOLUTION: The pendulous capacitive accelerometer 10 includes: a substrate 14 having a substantially planar upper surface with an electrode section; and a sensing plate having a central anchor portion 16 supported on the upper surface of the substrate 14 to define a hinge axis x. The sensing plate 12 includes: a solid proof mass 22 on a first side of the central anchor portion 16; and a substantially hollow proof mass 20 on a second side of the central anchor portion 16, providing for reduced overall chip size and balanced gas damping. The solid proof mass 22 has a first lower surface with a first electrode element thereon, and the substantially hollow proof mass 20 has a second lower surface with a second electrode element thereon. Both the solid proof mass 22 and the hollow proof mass 20 have the same capacitive sensing area. The sensing plate 12 rotates about the hinge axis x relative to the upper surface of the substrate 14 in response to an acceleration. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a high temperature electrostatic capacitive type static/dynamic pressure sensor for the use of a pressure probe which has a diaphragm composed in order to enable more exact measurement of pressure (dynamic or static) at high temperature. SOLUTION: The electrostatic capacitive type pressure probe is used for high temperature, such as for use in a gas turbine engine. The electrostatic capacitive type probe or pressure sensor 10 includes a sensor housing 20 that defines an interior detection chamber 42 having a pressure port 36 and an interior reference chamber 52 positioned adjacent to a detection electrode 62. The reference chamber 52 is separated from the detection chamber 42 by a flexible diaphragm 44 made from Haynes 230 alloy, wherein the deflection of the diaphragm 44 in response to an applied pressure in the detection chamber 42 corresponds to a change in electrostatic capacitive value by the detection electrode 62. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an extremely robust and high-performance triaxial accelerometer including both of an in-plane accelerometer and an out-of-plane accelerometer fabricated on a single chip by using a MEMS manufacturing technology.SOLUTION: A structure of the accelerometer includes an in-plane accelerometer with a substrate rigidly attached to an object, and a proof mass 102 formed from an integrally molded material and movably positioned at predetermined distance above the substrate 104. The proof mass 102 includes a plurality of electrode protrusions 116 extending downward from the proof mass to form a gap of varying height between the proof mass and the substrate. The proof mass 102 is configured to move in a direction parallel to the upper surfaces of each of the plurality of substrate electrodes 108, 110 when the object is accelerating, which results in a change in the area of the gap, and a change in capacitance between the substrate and the proof mass. The in-plane accelerometer can be fabricated using the same techniques used to fabricate an out-of-plane accelerometer and is suitable for high-shock applications.
Abstract:
PROBLEM TO BE SOLVED: To provide a microstructure system or mirror array. SOLUTION: A micro mirror array includes an upper wafer portion having a plurality of movable reflective surfaces and defining a coverage area in top view. The array further includes a lower wafer portion located generally below the upper wafer portion and coupled thereto. The lower wafer portion includes at least one connection site located thereon, and at least one connection site is electrically or operatively coupled to at least one component which can control the movement of at least one of the reflective surfaces. The at least one connection site is not generally located within the coverage area of the upper wafer portion. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure sensor that utilizes improved heat-resistant detecting materials. SOLUTION: The pressure sensor (10) includes a movable component (16) that is configured to move, when the pressure sensor is exposed to differential pressure thereacross, and a pressure-sensing component (20) located on the movable component. The pressure-sensing component includes an electrically conductive electron gas which changes its electrical resistance thereacross, upon the movement of the movable component. The pressure sensor is configured, such that leads can be coupled to the pressure sensing component and the pressure sensing component can output a signal via the leads. The signal is related to pressure to which the pressure sensor is exposed. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
A micro mirror structure including a plurality of individually movable mirrors. Each mirror has a generally concave shape from a top perspective at a temperature of about 20 degrees Celsius and has a generally convex shape from a top perspective at a temperature of about 85 degrees Celsius. In one embodiment, the radius of curvature may be greater than about 500 mm at a temperature of about 20 degrees Celsius and may be less than about -600 mm at a temperature of about 85 degrees Celsius at a thickness of about 10 microns. In another embodiment, the invention is a micro mirror structure including a plurality of individually movable mirrors arranged in an array. Each mirror includes a substrate, a diffusion barrier layer located above the substrate, and a reflective layer located above the diffusion barrier layer. The diffusion barrier layer generally limits the diffusion of the top reflective layer through the diffusion barrier layer.
Abstract:
A pressure sensor for use in a harsh environment including a substrate and a sensor die directly coupled to the substrate by a bond frame positioned between the substrate and the sensor die. The sensor die includes a generally flexible diaphragm configured to flex when exposed to a sufficient differential pressure thereacross. The sensor further includes a piezoelectric or piezoresistive sensing element at least partially located on the diaphragm such that the sensing element provides an electrical signal upon flexure of the diaphragm. The sensor also includes an connecting component electrically coupled to the sensing element at a connection location that is fluidly isolated from the diaphragm by the bond frame. The bond frame is made of materials and the connecting component is electrically coupled to the sensing element by the same materials of the bond frame.
Abstract:
A harsh environment transducer including a substrate having a first surface and a second surface, wherein the second surface is in communication with the environment. The transducer includes a device layer sensor means located on the substrate for measuring a parameter associated with the environment. The sensor means including a single crystal semiconductor material having a thickness of less than about 0.5 microns. The transducer further includes an output contact located on the substrate and in electrical communication with the sensor means. The transducer includes a package having an internal package space and a port for communication with the environment. The package receives the substrate in the internal package space such that the first surface of the substrate is substantially isolated from the environment and the second surface of the substrate is substantially exposed to the environment through the port. The transducer further includes a connecting component coupled to the package and a wire electrically connecting the connecting component and the output contact such that an output of the sensor means can be communicated. An external surface of the wire is substantially platinum, and an external surface of at least one of the output contact and the connecting component is substantially platinum.
Abstract:
Disclosed are capacitive pressure probes or sensors for high temperature applications. The capacitive pressure sensors of the present invention include, inter alia, a sapphire diaphragm which is disposed within an interior sensing chamber of the probe housing and has a first electrode formed on a central portion thereof. The central portion of the diaphragm and the first electrode are adapted and configured to deflect in response to pressure variations encountered within an interior sensing chamber and by the pressure sensor. A sapphire substrate which has a second electrode formed thereon is fused to the sapphire diaphragm about its periphery to form a sapphire stack and to define a reference chamber therebetween. Prior to fusing the sapphire diaphragm to the sapphire substrate, all contact surfaces are chemically treated and prepared using plasma activation, so as to create a bonding layer and to reduce the temperature required for the fusion.