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公开(公告)号：EP3715263A1
公开(公告)日：2020-09-30
申请号：EP19213954.1
申请日：2019-12-05
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： GILKISON, Brian A. , REID, Alexander N. , HOFFMANN, Nathan
IPC: B64D43/00
Abstract: A thermal management system for a sensor module is disclosed that includes a housing (10) enclosing the sensor module and having a bottom wall (28) with a reception port (26) formed therein, and a thermal isolation puck (20) installed within the reception port formed in the bottom wall of the housing for reducing the rate at which thermal energy from a heater located within an adjacent flush static plate (30) is lost to the housing.
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