公开(公告)号：EP3742467A1

公开(公告)日：2020-11-25

申请号：EP19210644.1

申请日：2019-11-21

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： POTASEK, David P. ,  PING-TAO FOK, Ben ,  BACKMAN, Roger Alan

IPC: H01H69/02 ,  H01H85/10 ,  H01H85/041

Abstract: Disclosed is a thin-film micro-fuse assembly having: a substrate (116); an insulating layer disposed on the substrate, the insulating layer comprising silicon dioxide; a conductor (130) disposed on the insulating layer, the conductor forming: an inlet terminal (130a), an outlet terminal (130b) and a fuse element (130c) between the inlet terminal and the outlet terminal, the inlet terminal and the outlet terminal widthwise converging toward the fuse element, and the fuse element having a first thickness and a first width that is between 1 and 5 times the first thickness.