公开(公告)号：US5927589A

公开(公告)日：1999-07-27

申请号：US978019

申请日：1997-11-25

Applicant: Renyi Yang

Inventor： Renyi Yang

IPC: B23K3/08 ,  B23K37/04 ,  H01L21/00 ,  H05K13/04 ,  B23K37/00 ,  B25B11/00 ,  B25B27/14

CPC classification number: H01L21/67132 ,  B23K3/087 ,  B23K37/0426 ,  H05K13/046 ,  B23K2201/40 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53961

Abstract: A fixture for use in the bonding of a plurality of chips each to a respective one of a plurality of substrates includes a lower vacuum chuck and a frame member supported on the chuck for reciprocatory motion toward and away from the chuck surface. The chuck surface is arranged to hold substrates with predeposited solder in pockets at predetermined locations thereon. The frame member has openings aligned with those pockets and weights which extend through the openings. After substrates are placed on the chuck surface, the substrates are heated so that the predeposited solder reaches eutectic status, and then chips are placed on the substrates. The frame member is then mounted on the chuck and gradually lowered until the weights press against respective chips, thereby holding the chips in position on the substrates. The entire assembly is then transported to a solder reflow bonding station.

Abstract translation: 用于将多个芯片各自连接到多个基板中的相应一个的多个芯片的固定装置包括下部真空卡盘和支撑在卡盘上以朝向和远离卡盘表面往复运动的框架构件。 卡盘表面被布置成在其上的预定位置处将预沉积的焊料保持在凹穴中。 框架构件具有与延伸穿过开口的那些口袋和重物对齐的开口。 将基板放置在卡盘表面上之后，基板被加热，使得预沉积的焊料达到共晶状态，然后将芯片放置在基板上。 然后将框架构件安装在卡盘上并逐渐降低，直到重物压在相应的芯片上，从而将芯片保持在基板上的适当位置。 然后将整个组件运输到焊料回流焊接站。

公开(公告)号：US06371665B1

公开(公告)日：2002-04-16

申请号：US09344656

申请日：1999-06-25

Applicant: Joseph P. Keska ,  Steven L. Moyer ,  Mary J. Nadeau ,  John William Osenbach ,  Renyi Yang

Inventor： Joseph P. Keska ,  Steven L. Moyer ,  Mary J. Nadeau ,  John William Osenbach ,  Renyi Yang

IPC: G02B636

CPC classification number: G02B6/4204 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4246 ,  G02B6/4255 ,  G02B6/4269

Abstract: The invention is an optoelectronic device including an optical subassembly enclosed within a plastic housing. The housing includes a wall with an aperture and a lens mounted therein. A plastic receptacle is mounted to the wall. The receptacle includes an opening which is aligned with the lens and which is capable of receiving an optical fiber so that the fiber is aligned with light emitted from the optical assembly. The receptacle is preferably mounted to the wall by means of epoxy.

Abstract translation: 本发明是一种光电器件，其包括封装在塑料外壳内的光学子组件。 壳体包括具有孔的壁和安装在其中的透镜。 塑料容器安装在墙上。 插座包括与透镜对准并且能够接收光纤的开口，使得光纤与从光学组件发射的光对准。 容器优选通过环氧树脂安装到壁上。

公开(公告)号：US06632028B1

公开(公告)日：2003-10-14

申请号：US09938389

申请日：2001-08-24

Applicant: Renyi Yang ,  Thomas Reynolds ,  Robert A. Craven ,  Aaron Hawkins

Inventor： Renyi Yang ,  Thomas Reynolds ,  Robert A. Craven ,  Aaron Hawkins

IPC: G02B636

CPC classification number: C12N9/0022 ,  A61K38/00

Abstract: An apparatus and method for aligning an optical fiber with an optical device having bond pads attached thereto. The apparatus includes a fiber mount assembly having a body portion with an opening provided therein to receive the optical fiber, and two leg portions integrally connecting to and extending from the body portion. Bond pads are also attached to the two leg portions. The apparatus further includes an optical device mount assembly having bond pads attached thereto, and a plurality of eutectic solder bumps provided on the bond pads. The eutectic solder bumps connect the bond pads of the optical device and the two leg portions of the fiber mount assembly to the bond pads of the optical device mount assembly. The concentration of a component of the eutectic material in the solder bumps is increased, via a reaction between the bond pads and the solder bumps, until the eutectic material hardens and rigidly connects the bond pads of the optical device and the two leg portions of the fiber mount assembly to the bond pads of the optical device mount assembly, aligning the optical fiber with the optical device.

Abstract translation: 一种用于使光纤与具有连接到其上的接合垫的光学装置对准的装置和方法。 该装置包括具有主体部分的光纤安装组件，该主体部分设置有用于容纳光纤的开口，以及与主体部分整体连接并从身体部分延伸的两个腿部。 接合垫也附接到两个腿部。 该装置还包括具有连接到其上的接合焊盘的光学装置安装组件和设置在接合焊盘上的多个共晶焊料凸块。 共晶焊料凸块将光学器件的接合焊盘和光纤安装组件的两个腿部连接到光学器件安装组件的接合焊盘。 通过接合焊盘和焊料凸块之间的反应，焊料凸块中的共晶材料的成分浓度增加，直到共晶材料硬化并刚性地连接光学器件的接合焊盘和 光纤安装组件到光学装置安装组件的接合焊盘，使光纤与光学装置对准

公开(公告)号：US06580543B1

公开(公告)日：2003-06-17

申请号：US09465468

申请日：1999-12-16

Applicant: Zhencan Frank Fan ,  Hong-Tai Man ,  Arlen R. Martin ,  Steven L. Moyer ,  Mary J. Nadeau ,  Steven P. O'Neill ,  John William Osenbach ,  Edward A. Pitman ,  Renyi Yang ,  Craig A. Young

Inventor： Zhencan Frank Fan ,  Hong-Tai Man ,  Arlen R. Martin ,  Steven L. Moyer ,  Mary J. Nadeau ,  Steven P. O'Neill ,  John William Osenbach ,  Edward A. Pitman ,  Renyi Yang ,  Craig A. Young

IPC: G02B630

CPC classification number: G02B6/268 ,  G02B6/4206 ,  H04B10/2581

Abstract: In accordance with the invention, a multimode optical fiber communication system is provided with offset illumination by disposing an optical pinhole adjacent an end of the multimode fiber core and offset from the center of the core. The pinhole permits direct offset illumination without the difficulty and expense of a conventional patch-cord assembly.

Abstract translation: 根据本发明，多模光纤通信系统通过在多模光纤芯的端部附近设置光学针孔并偏离芯的中心而提供偏移照明。 针孔允许直接偏移照明，而不需要常规拼接组件的困难和费用。

公开(公告)号：US5971257A

公开(公告)日：1999-10-26

申请号：US257787

申请日：1999-02-25

Applicant: Renyi Yang

Inventor： Renyi Yang

IPC: B23K3/08 ,  B23K37/04 ,  H01L21/00 ,  H05K13/04 ,  B23K5/22 ,  B23K37/00 ,  B23P19/00 ,  B25B11/00

CPC classification number: H01L21/67132 ,  B23K3/087 ,  B23K37/0426 ,  H05K13/046 ,  B23K2201/40 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53961

Abstract: A fixture for use in the bonding of a plurality of chips each to a respective one of a plurality of substrates includes a lower vacuum chuck and a frame member supported on the chuck for reciprocatory motion toward and away from the chuck surface. The chuck surface is arranged to hold substrates with predeposited solder in pockets at predetermined locations thereon. The frame member has openings aligned with those pockets and weights which extend through the openings. After substrates are placed on the chuck surface, the substrates are heated so that the predeposited solder reaches eutectic status, and then chips are placed on the substrates. The frame member is then mounted on the chuck and gradually lowered until the weights press against respective chips, thereby holding the chips in position on the substrates. The entire assembly is then transported to a solder reflow bonding station.

Abstract translation: 用于将多个芯片各自连接到多个基板中的相应一个的多个芯片的固定装置包括下部真空卡盘和支撑在卡盘上以朝向和远离卡盘表面往复运动的框架构件。 卡盘表面被布置成在其上的预定位置处将预沉积的焊料保持在凹穴中。 框架构件具有与延伸穿过开口的那些口袋和重物对齐的开口。 将基板放置在卡盘表面之后，加热基板，使预沉积的焊料达到共晶状态，然后将芯片放置在基板上。 然后将框架构件安装在卡盘上并逐渐降低，直到重物压在相应的芯片上，从而将芯片保持在基板上的适当位置。 然后将整个组件运输到焊料回流焊接站。