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公开(公告)号：WO1998002716A1
公开(公告)日：1998-01-22
申请号：PCT/US1997010833
申请日：1997-06-19
Applicant: ROBOTIC VISION SYSTEMS, INC.
Inventor： ROBOTIC VISION SYSTEMS, INC. , LIU, Kuo-Ching , LIANG, Chu-Kwo , FWU, Jong-Kae , HUANG, Chung-Po
IPC: G01B11/03
CPC classification number: G01B11/002
Abstract: A system is provided that simultaneously gathers three-dimensional and two-dimensional data for use in inspecting objects such as chip carriers for defects. Specifically, a source laser beam (303) is directed to an object and forms a spot (305) at the point of impingement at a known X-Y position on the object. The laser beam is reflected at the spot and light reflected off-axially (306, 307) with respect to the source laser beam (303) is detected by two position sensing detectors (PSDs) (310, 311). Simultaneous to detecting off-axially reflected light, retro-reflected light (i.e., the light reflected approximately co-axial with the source laser) is detected by a photo diode array (313). Three dimensional object information is determined from the position sensing detector (310, 311) signals and two-dimensional object information is determined from the photo diode array (313) signal.
Abstract translation: 提供了一种同时收集三维和二维数据以用于检查诸如用于缺陷的芯片载体的物体的系统。 具体地，源激光束（303）被引导到物体，并且在物体上的已知X-Y位置处的冲击点处形成点（305）。 激光束在点处被反射，并且通过两个位置感测检测器（PSD）（310,311）检测相对于源激光束（303）离轴（306,307）反射的光。 同时检测离轴反射光，通过光电二极管阵列（313）检测回射反射光（即，与源激光大致同轴反射的光）。 从位置检测检测器（310,311）确定三维物体信息，并根据光电二极管阵列（313）信号确定二维物体信息。
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公开(公告)号：EP0979386B1
公开(公告)日：2006-08-02
申请号：EP97931329.3
申请日：1997-06-19
Applicant: Robotic Vision Systems Inc.
Inventor： LIU, Kuo-Ching , LIANG, Chu-Kwo , FWU, Jong-Kae , HUANG, Chung-Po
CPC classification number: G01B11/002
Abstract: A system is provided that simultaneously gathers three-dimensional and two-dimensional data for use in inspecting objects such as chip carriers for defects. Specifically, a source laser beam (303) is directed to an object and forms a spot (305) at the point of impingement at a known X-Y position on the object. The laser beam is reflected at the spot and light reflected off-axially (306, 307) with respect to the source laser beam (303) is detected by two position sensing detectors (PSDs) (310, 311). Simultaneous to detecting off-axially reflected light, retro-reflected light (i.e., the light reflected approximately co-axial with the source laser) is detected by a photo diode array (313). Three dimensional object information is determined from the position sensing detector (310, 311) signals and two-dimensional object information is determined from the photo diode array (313) signal.
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公开(公告)号：EP0979386A1
公开(公告)日：2000-02-16
申请号：EP97931329.3
申请日：1997-06-19
Applicant: Robotic Vision Systems Inc.
Inventor： LIU, Kuo-Ching , LIANG, Chu-Kwo , FWU, Jong-Kae , HUANG, Chung-Po
CPC classification number: G01B11/002
Abstract: A system is provided that simultaneously gathers three-dimensional and two-dimensional data for use in inspecting objects such as chip carriers for defects. Specifically, a source laser beam (303) is directed to an object and forms a spot (305) at the point of impingement at a known X-Y position on the object. The laser beam is reflected at the spot and light reflected off-axially (306, 307) with respect to the source laser beam (303) is detected by two position sensing detectors (PSDs) (310, 311). Simultaneous to detecting off-axially reflected light, retro-reflected light (i.e., the light reflected approximately co-axial with the source laser) is detected by a photo diode array (313). Three dimensional object information is determined from the position sensing detector (310, 311) signals and two-dimensional object information is determined from the photo diode array (313) signal.
Abstract translation: 提供了一种系统，其同时收集三维和二维数据以用于检查诸如芯片载体的物体的缺陷。 具体而言，源激光束（303）被引导至物体并且在物体上的已知X-Y位置处的撞击点处形成点（305）。 激光束在该点反射，并且由两个位置感测检测器（PSD）（310,311）检测相对于源激光束（303）轴向（306,307）反射的光。 在检测离轴反射光的同时，由光电二极管阵列（313）检测回射光（即与源激光器近似同轴反射的光）。 根据位置感测检测器（310,311）信号确定三维物体信息，并且从光电二极管阵列（313）信号确定二维物体信息。
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