公开(公告)号：US20210198389A1

公开(公告)日：2021-07-01

申请号：US17106261

申请日：2020-11-30

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Colin Calabrese ,  Michael K. Gallagher ,  Kevin Y. Wang ,  Robert K. Barr

IPC: C08F2/50 ,  G03F7/028 ,  C08F222/40 ,  C08G73/10 ,  G03F7/20 ,  C08F212/08 ,  C08F220/18 ,  C08F2/38 ,  C08F236/04

Abstract: The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.

公开(公告)号：US11603422B2

公开(公告)日：2023-03-14

申请号：US17106277

申请日：2020-11-30

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Colin Calabrese ,  Michael K Gallagher ,  Robert K Barr

IPC: C08F212/32 ,  C08F228/06 ,  C08F226/06 ,  C08F212/12 ,  C08F236/02 ,  C08F226/12 ,  C08F236/04 ,  C08F212/04 ,  C08F212/08

Abstract: There is provided a polymer which is the copolymerization product from a mixture including: (a) 10-50 mol % of at least one addition polymerizable arylcyclobutene monomer; (b) 15-50 mol % of at least one addition polymerizable diene monomer; and (c) 15-60 mol % of at least one addition polymerizable aromatic vinyl monomer. The polymer can be used in electronic applications.

公开(公告)号：US11920023B2

公开(公告)日：2024-03-05

申请号：US17731690

申请日：2022-04-28

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Colin Calabrese ,  Christine Hatter

IPC: C08F212/32 ,  C08F212/12 ,  C08F226/06 ,  C08F228/06 ,  C08L25/02 ,  C08L43/04

CPC classification number: C08L25/02 ,  C08L43/04 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2312/00

Abstract: There is provided a dielectric composite material comprising (a) 20-50 weight % total solids of at least one thermosetting resin and other resin components; and (b) 50-70 weight % total solids of at least one inorganic particulate filler; where the at least one inorganic particulate filler is surface modified with one or more acrylic-based silane coupling agents.

公开(公告)号：US20210198396A1

公开(公告)日：2021-07-01

申请号：US17113147

申请日：2020-12-07

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Jaclyn Murphy ,  Colin Hayes ,  Michael K. Gallagher ,  Kristen Flajslik ,  Charles R. Kinzie ,  Colin Calabrese ,  Qing Min Wang

IPC: C08F212/32 ,  C08F2/06 ,  C08F236/04 ,  C08K5/3415 ,  B05D7/24

Abstract: The present disclosure relates to a chemical composition produced from polymerizing an arylcyclobutene monomer, and a bismaleimide compound as a cross-linker; and its use, especially in electronic devices.

公开(公告)号：US11639398B2

公开(公告)日：2023-05-02

申请号：US17106261

申请日：2020-11-30

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Colin Calabrese ,  Michael K. Gallagher ,  Kevin Y. Wang ,  Robert K. Barr

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  G03F7/028 ,  C08F222/40 ,  C08G73/10 ,  G03F7/20 ,  C08F220/18 ,  C08F2/38 ,  C08F236/04 ,  C08F212/08 ,  C08K5/3417 ,  C08K5/33 ,  C08K5/372

Abstract: The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.

公开(公告)号：US20210198395A1

公开(公告)日：2021-07-01

申请号：US17106277

申请日：2020-11-30

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Colin Calabrese ,  Michael K Gallagher ,  Robert K Barr

IPC: C08F212/32 ,  C08F212/12 ,  C08F226/06 ,  C08F228/06

Abstract: There is provided a polymer which is the copolymerization product from a mixture including: (a) 10-50 mol % of at least one addition polymerizable arylcyclobutene monomer; (b) 15-50 mol % of at least one addition polymerizable diene monomer; and (c) 15-60 mol % of at least one addition polymerizable aromatic vinyl monomer. The polymer can be used in electronic applications.