公开(公告)号：US20210198389A1

公开(公告)日：2021-07-01

申请号：US17106261

申请日：2020-11-30

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Colin Calabrese ,  Michael K. Gallagher ,  Kevin Y. Wang ,  Robert K. Barr

IPC: C08F2/50 ,  G03F7/028 ,  C08F222/40 ,  C08G73/10 ,  G03F7/20 ,  C08F212/08 ,  C08F220/18 ,  C08F2/38 ,  C08F236/04

Abstract: The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.

公开(公告)号：US20240317985A1

公开(公告)日：2024-09-26

申请号：US18187201

申请日：2023-03-21

Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC ,  DUPONT ELECTRONICS, INC.

Inventor： Colin Hayes ,  Anton Chavez ,  Nora Sabina Radu ,  Jaclyn Murphy ,  Qing Min Wang ,  Tao Huang ,  Anton Li ,  Tanya N. Singh-Rachford ,  Michael Gallagher

IPC: C08L23/20 ,  C08K5/5399 ,  C08L77/10 ,  C08L79/08

CPC classification number: C08L23/20 ,  C08K5/5399 ,  C08L77/10 ,  C08L79/08 ,  C08L2203/16

Abstract: There is provided a resin composition from a mixture including: (a) 30-80 weight % of at least one thermosetting resin; and (b) 20-70 weight % of at least one soluble polyimide resin. The resin composition can be used in electronics applications.

公开(公告)号：US11603422B2

公开(公告)日：2023-03-14

申请号：US17106277

申请日：2020-11-30

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Colin Calabrese ,  Michael K Gallagher ,  Robert K Barr

IPC: C08F212/32 ,  C08F228/06 ,  C08F226/06 ,  C08F212/12 ,  C08F236/02 ,  C08F226/12 ,  C08F236/04 ,  C08F212/04 ,  C08F212/08

Abstract: There is provided a polymer which is the copolymerization product from a mixture including: (a) 10-50 mol % of at least one addition polymerizable arylcyclobutene monomer; (b) 15-50 mol % of at least one addition polymerizable diene monomer; and (c) 15-60 mol % of at least one addition polymerizable aromatic vinyl monomer. The polymer can be used in electronic applications.

公开(公告)号：US20190127506A1

公开(公告)日：2019-05-02

申请号：US15801784

申请日：2017-11-02

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Tina Aoude ,  Robert K. Barr ,  David Fleming ,  Michael K. Gallagher ,  Gregory D. Prokopowicz ,  Michelle Riener

IPC: C08F226/06 ,  C07D221/04 ,  C08F220/18 ,  C08F212/08 ,  C08F212/12 ,  C08F236/04 ,  C08K5/00

Abstract: The present invention provides a low temperature polymerizing and curing polymer composition comprising, in copolymerized form, one or more addition polymerizable arylcyclobutene monomers A having as a cyclobutene ring substituent one or more groups chosen from alkyl; heteroatom containing alkyl; aryl; heteroatom containing aryl; or heteroatom containing aryloxy, one or more aromatic addition polymerizable second monomers, and one or more other addition polymerizable monomers chosen from an addition polymerizable nitrogen heterocycle containing third monomer, an addition polymerizable fourth monomer, or, preferably, both of the one or more third monomers and the one or more fourth monomers. The polymer compositions find use in making films or coatings for use in electronics applications.

公开(公告)号：US10513568B2

公开(公告)日：2019-12-24

申请号：US15828972

申请日：2017-12-01

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Michael K. Gallagher ,  Michelle Riener

IPC: C08F32/02 ,  C08F12/02 ,  C08G81/02 ,  C07C69/01 ,  C07C35/31 ,  C07C23/18 ,  C08K5/09 ,  C07C69/017 ,  C07C41/01 ,  C08F12/22 ,  C08F212/08 ,  G01N25/48

Abstract: The present invention provides methods of making low energy polymerizable monomers and resins for use in making dielectric materials. The methods comprise deprotecting or deacylating an organic alkali cleavable protecting group containing addition polymerizable, amine containing aromatic monomer or oligoaromatic phenol resin containing an organic alkali cleavable protecting group, such as a C2 to C9 alkanoyl group, preferably, an acyl group, by hydrolyzing to remove the protecting group in organic alkali in a polar solvent containing an excess of alkali C1 to C7 alkoxide and form a hydroxyl functional monomer or resin, followed by; reacting via nucleophilic substitution the resulting hydroxyl functional monomer or resin with an alpha-halide (α-halide) or strong acid conjugate leaving group containing arylcyclobutene compound in a polar solvent, to yield a product an arylcyclobutene-containing addition polymerizable or amine containing aromatic monomer or oligoaromatic phenol resin having an ether linkage from the cyclobutene ring to an aromatic group of the addition polymerizable aromatic monomer, aromatic amine or oligoaromatic phenol.

公开(公告)号：US20190169327A1

公开(公告)日：2019-06-06

申请号：US15828972

申请日：2017-12-01

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Michael K. Gallagher ,  Michelle Riener

IPC: C08F32/02 ,  C08F12/02 ,  C08G81/02 ,  C08K5/09 ,  C07C69/017 ,  C07C35/31 ,  C07C23/18

Abstract: The present invention provides methods of making low energy polymerizable monomers and resins for use in making dielectric materials. The methods comprise deprotecting or deacylating an organic alkali cleavable protecting group containing addition polymerizable, amine containing aromatic monomer or oligoaromatic phenol resin containing an organic alkali cleavable protecting group, such as a C2 to C9 alkanoyl group, preferably, an acyl group, by hydrolyzing to remove the protecting group in organic alkali in a polar solvent containing an excess of alkali C1 to C7 alkoxide and form a hydroxyl functional monomer or resin, followed by; reacting via nucleophilic substitution the resulting hydroxyl functional monomer or resin with an alpha-halide (α-halide) or strong acid conjugate leaving group containing arylcyclobutene compound in a polar solvent, to yield a product an arylcyclobutene-containing addition polymerizable or amine containing aromatic monomer or oligoaromatic phenol resin having an ether linkage from the cyclobutene ring to an aromatic group of the addition polymerizable aromatic monomer, aromatic amine or oligoaromatic phenol.

公开(公告)号：US11920023B2

公开(公告)日：2024-03-05

申请号：US17731690

申请日：2022-04-28

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Colin Calabrese ,  Christine Hatter

IPC: C08F212/32 ,  C08F212/12 ,  C08F226/06 ,  C08F228/06 ,  C08L25/02 ,  C08L43/04

CPC classification number: C08L25/02 ,  C08L43/04 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2312/00

Abstract: There is provided a dielectric composite material comprising (a) 20-50 weight % total solids of at least one thermosetting resin and other resin components; and (b) 50-70 weight % total solids of at least one inorganic particulate filler; where the at least one inorganic particulate filler is surface modified with one or more acrylic-based silane coupling agents.

公开(公告)号：US20210198396A1

公开(公告)日：2021-07-01

申请号：US17113147

申请日：2020-12-07

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Jaclyn Murphy ,  Colin Hayes ,  Michael K. Gallagher ,  Kristen Flajslik ,  Charles R. Kinzie ,  Colin Calabrese ,  Qing Min Wang

IPC: C08F212/32 ,  C08F2/06 ,  C08F236/04 ,  C08K5/3415 ,  B05D7/24

Abstract: The present disclosure relates to a chemical composition produced from polymerizing an arylcyclobutene monomer, and a bismaleimide compound as a cross-linker; and its use, especially in electronic devices.

公开(公告)号：US20200087429A1

公开(公告)日：2020-03-19

申请号：US16687765

申请日：2019-11-19

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Michael K. Gallagher ,  Michelle Riener

IPC: C08F32/02 ,  C08F212/08 ,  C08F12/22 ,  C07C41/01 ,  C08F12/02 ,  C08G81/02 ,  C07C69/017 ,  C07C35/31 ,  C07C23/18 ,  C08K5/09

Abstract: The present invention provides methods of making low energy polymerizable monomers and resins for use in making dielectric materials. The methods comprise deprotecting or deacylating an organic alkali cleavable protecting group containing addition polymerizable, amine containing aromatic monomer or oligoaromatic phenol resin containing an organic alkali cleavable protecting group, such as a C2 to C9 alkanoyl group, preferably, an acyl group, by hydrolyzing to remove the protecting group in organic alkali in a polar solvent containing an excess of alkali C1 to C7 alkoxide and form a hydroxyl functional monomer or resin, followed by; reacting via nucleophilic substitution the resulting hydroxyl functional monomer or resin with an alpha-halide (a-halide) or strong acid conjugate leaving group containing arylcyclobutene compound in a polar solvent, to yield a product an arylcyclobutene-containing addition polymerizable or amine containing aromatic monomer or oligoaromatic phenol resin having an ether linkage from the cyclobutene ring to an aromatic group of the addition polymerizable aromatic monomer, aromatic amine or oligoaromatic phenol.

公开(公告)号：US11639398B2

公开(公告)日：2023-05-02

申请号：US17106261

申请日：2020-11-30

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Colin Hayes ,  Colin Calabrese ,  Michael K. Gallagher ,  Kevin Y. Wang ,  Robert K. Barr

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  G03F7/028 ,  C08F222/40 ,  C08G73/10 ,  G03F7/20 ,  C08F220/18 ,  C08F2/38 ,  C08F236/04 ,  C08F212/08 ,  C08K5/3417 ,  C08K5/33 ,  C08K5/372

Abstract: The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.