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公开(公告)号：US11692895B2
公开(公告)日：2023-07-04
申请号：US17217234
申请日：2021-03-30
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Jun Zheng
CPC classification number: G01L13/026 , G01F1/36 , G01L9/0048 , G01L13/025 , G01L19/142 , G01L19/145 , G01L27/005
Abstract: A differential MEMS pressure sensor includes a topping wafer with a top side and a bottom side, a diaphragm wafer having a top side connected to the bottom side of the topping wafer and a bottom side, and a backing wafer having a top side connected to the bottom side of the diaphragm wafer and a bottom side. The topping wafer includes a first cavity formed in the bottom side of the topping wafer. The diaphragm wafer includes a diaphragm, a second cavity formed in the bottom side of the diaphragm wafer underneath the diaphragm, an outer portion surrounding the diaphragm, and a trench formed in the top side of the diaphragm wafer and positioned in the outer portion surrounding the diaphragm.
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公开(公告)号：US20220316973A1
公开(公告)日：2022-10-06
申请号：US17217234
申请日：2021-03-30
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Jun Zheng
Abstract: A differential MEMS pressure sensor includes a topping wafer with a top side and a bottom side, a diaphragm wafer having a top side connected to the bottom side of the topping wafer and a bottom side, and a backing wafer having a top side connected to the bottom side of the diaphragm wafer and a bottom side. The topping wafer includes a first cavity formed in the bottom side of the topping wafer. The diaphragm wafer includes a diaphragm, a second cavity formed in the bottom side of the diaphragm wafer underneath the diaphragm, an outer portion surrounding the diaphragm, and a trench formed in the top side of the diaphragm wafer and positioned in the outer portion surrounding the diaphragm.
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公开(公告)号：US20220307929A1
公开(公告)日：2022-09-29
申请号：US17216049
申请日：2021-03-29
Applicant: Rosemount Aerospace Inc.
Inventor： Jun Zheng
IPC: G01L9/00
Abstract: A microelectromechanical system (MEMS) strain gauge pressure sensor includes a top wafer stack having a top surface and a first cavity that is configured to receive a first fluid at a first pressure, a backing wafer having a bottom surface opposite the top surface of the top wafer stack; a diaphragm wafer positioned between the top wafer stack and the backing wafer and having a second cavity that is configured to receive a second fluid at a second pressure, and a pedestal connected laterally to the top wafer stack, the backing wafer, and the diaphragm wafer. The diaphragm wafer includes a diaphragm extending between the first cavity and the second cavity, and a resistor positioned on the diaphragm. The MEMS strain gauge pressure sensor has a central axis such that the MEMS strain gauge pressure sensor has mechanical symmetries about the central axis.
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公开(公告)号：US10823631B2
公开(公告)日：2020-11-03
申请号：US15956657
申请日：2018-04-18
Applicant: Rosemount Aerospace Inc.
Inventor： Jun Zheng
Abstract: A MEMS pressure sensor includes a first plate with a hole on a diaphragm bonded to the first plate around its rim with the diaphragm positioned over the hole. An isolation frame is bonded to the diaphragm and a second plate with a pillar is bonded to the isolation frame around its rim to form a cavity such that the end of the pillar in the cavity is proximate a surface of the diaphragm. The diaphragm and second plate form a capacitive sensor which changes output upon deflection of the diaphragm relative to the second plate.
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Patent Agency Ranking
公开(公告)号：US20190323912A1
公开(公告)日：2019-10-24
申请号：US15956657
申请日：2018-04-18
Applicant: Rosemount Aerospace Inc.
Inventor： Jun Zheng
Abstract: A MEMS pressure sensor includes a first plate with a hole on a diaphragm bonded to the first plate around its rim with the diaphragm positioned over the hole. An isolation frame is bonded to the diaphragm and a second plate with a pillar is bonded to the isolation frame around its rim to form a cavity such that the end of the pillar in the cavity is proximate a surface of the diaphragm. The diaphragm and second plate form a capacitive sensor which changes output upon deflection of the diaphragm relative to the second plate.
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公开(公告)号：US20240302237A1
公开(公告)日：2024-09-12
申请号：US18118809
申请日：2023-03-08
Applicant: Rosemount Aerospace Inc.
Inventor： Jun Zheng , Weibin Zhang
CPC classification number: G01L9/0052 , B81B7/0041 , G01L19/147 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315
Abstract: A packaged pressure sensor assembly is disclosed that includes a pressure sensor including an upper substrate and a lower substrate bonded to one another by way of a first glass frit having a first bonding temperature, so as to define a hermetically sealed pressure sensing chamber therebetween, and a housing defining an internal cavity having a base with a support surface for supporting the pressure sensor, wherein the pressure sensor is bonded to the support surface of the base by a second glass frit having a second bonding temperature that is lower than the first bonding temperature.
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公开(公告)号：US11879800B2
公开(公告)日：2024-01-23
申请号：US17216049
申请日：2021-03-29
Applicant: Rosemount Aerospace Inc.
Inventor： Jun Zheng
CPC classification number: G01L9/0051 , B81B7/0048 , G01L9/0052 , G01L9/0054 , G01L9/0055 , G01L9/0058
Abstract: A microelectromechanical system (MEMS) strain gauge pressure sensor includes a top wafer stack having a top surface and a first cavity that is configured to receive a first fluid at a first pressure, a backing wafer having a bottom surface opposite the top surface of the top wafer stack; a diaphragm wafer positioned between the top wafer stack and the backing wafer and having a second cavity that is configured to receive a second fluid at a second pressure, and a pedestal connected laterally to the top wafer stack, the backing wafer, and the diaphragm wafer. The diaphragm wafer includes a diaphragm extending between the first cavity and the second cavity, and a resistor positioned on the diaphragm. The MEMS strain gauge pressure sensor has a central axis such that the MEMS strain gauge pressure sensor has mechanical symmetries about the central axis.
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公开(公告)号：US20210302253A1
公开(公告)日：2021-09-30
申请号：US17180688
申请日：2021-02-19
Applicant: Rosemount Aerospace Inc.
Inventor： Jun Zheng
Abstract: A method of fabricating a capacitive micromechanical electrical system (MEMS) pressure sensor includes the steps of forming a backing wafer, forming a diaphragm wafer that includes a diaphragm configured to deflect from an applied force and a pressure cavity configured to produce on the diaphragm the applied force which is indicative of a system pressure; fusing the diaphragm wafer to the backing wafer thereby forming a base wafer, forming a top wafer, joining the top wafer to the base wafer, thereby forming a detector wafer. The diaphragm defines a first capacitor surface and the top wafer defines a second capacitor surface. A void separates the second capacitor surface from the first capacitor surface by a separation distance which is a capacitor gap. A capacitive MEMS pressure sensor is also disclosed.
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公开(公告)号：US11573145B2
公开(公告)日：2023-02-07
申请号：US17180688
申请日：2021-02-19
Applicant: Rosemount Aerospace Inc.
Inventor： Jun Zheng
Abstract: A method of fabricating a capacitive micromechanical electrical system (MEMS) pressure sensor includes the steps of forming a backing wafer, forming a diaphragm wafer that includes a diaphragm configured to deflect from an applied force and a pressure cavity configured to produce on the diaphragm the applied force which is indicative of a system pressure; fusing the diaphragm wafer to the backing wafer thereby forming a base wafer, forming a top wafer, joining the top wafer to the base wafer, thereby forming a detector wafer. The diaphragm defines a first capacitor surface and the top wafer defines a second capacitor surface. A void separates the second capacitor surface from the first capacitor surface by a separation distance which is a capacitor gap. A capacitive MEMS pressure sensor is also disclosed.
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