公开(公告)号：WO2010022373A1

公开(公告)日：2010-02-25

申请号：PCT/US2009/054692

申请日：2009-08-21

Applicant: S3C, INC. ,  DANGTRAN, John ,  HORTON, Roger

Inventor： DANGTRAN, John ,  HORTON, Roger

IPC: G01L9/06

CPC classification number: B81B7/0077 ,  B81B7/0019

Abstract: A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.

Abstract translation: 一种传感器装置和一种形成方法包括：芯片垫接收诸如MEMS器件的传感器装置。 MEMS器件具有第一热膨胀系数（CTE）。 芯片焊盘由具有与第一CTE兼容的第二CTE的材料制成。 管芯焊盘包括基座和具有符合第一和第二CTE的CTE的支撑结构。 管芯焊盘具有从基部突出的支撑结构。 支撑结构具有高度和壁厚度，当底座经受来自头部的热膨胀或收缩力时，使模具垫和MEMS装置感觉到的力最小化。

公开(公告)号：WO2013078006A1

公开(公告)日：2013-05-30

申请号：PCT/US2012/063901

申请日：2012-11-07

Applicant: S3C, INC.

Inventor： NZEADIBE, Ihioma, U. ,  HUSSAIN, Javed ,  CASTAGNA, Joseph ,  YUAN, Li ,  HORTON, Roger

IPC: H01L29/84

CPC classification number: G01L23/26 ,  F02D35/023 ,  F02D2400/22 ,  G01L19/0084

Abstract: The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.

Abstract translation: 所公开的本发明提供了用于各种实现的坚固，紧凑的感测装置，包括在内燃机过程中需要低成本精确的压力感测的汽车，船舶和其他燃烧技术的那些。 在本发明的一个或多个方面中，提出了具有柔性电路的MEMS传感器连接，并且其通信优选通过使用引线键合技术实现。

公开(公告)号：EP2783395A1

公开(公告)日：2014-10-01

申请号：EP12851847.9

申请日：2012-11-07

Applicant: S3C, Inc.

Inventor： NZEADIBE, Ihioma, U. ,  HUSSAIN, Javed ,  CASTAGNA, Joseph ,  YUAN, Li ,  HORTON, Roger

IPC: H01L29/84

CPC classification number: G01L23/26 ,  F02D35/023 ,  F02D2400/22 ,  G01L19/0084

Abstract: The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.

公开(公告)号：EP2567401A1

公开(公告)日：2013-03-13

申请号：EP11778212.8

申请日：2011-05-03

Applicant: S3C, Inc.

Inventor： HORTON, Roger ,  HUSSAIN, Javed

IPC: H01L23/58

CPC classification number: B81B7/0058 ,  B81C1/00888 ,  B81C2201/053 ,  G01L9/0055 ,  H01L21/78

Abstract: A method for separating a plurality of dies on a Micro-Electro-Mechanical System (MEMS) wafer comprising scribing a notch on a first side of the wafer between at least two of the plurality of dies on a first surface and depositing a metal on the first surface of the plurality of dies. The method further comprises scribing a second side of the wafer between at least two of the plurality of dies from a second surface thereof through the notch. The first side and second side are substantially parallel and opposite each other and the first surface and the second surface are substantially parallel and opposite each other. In a process in accordance with the present invention, a method to minimize chipping of the bonding portion of a MEMs device during sawing of the wafer is provided, which minimally affects the process steps associated with separating the die on a wafer.

公开(公告)号：EP2316008A1

公开(公告)日：2011-05-04

申请号：EP09808902.2

申请日：2009-08-21

Applicant: S3C, Inc.

Inventor： DANGTRAN, John ,  HORTON, Roger

IPC: G01L9/06

CPC classification number: B81B7/0077 ,  B81B7/0019

Abstract: A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.