公开(公告)号：WO2011140140A1

公开(公告)日：2011-11-10

申请号：PCT/US2011/035062

申请日：2011-05-03

Applicant: S3C, INC. ,  HUSSAIN, Javed ,  YUNUS, Mohammad ,  SUMINTO, James, T.

Inventor： HUSSAIN, Javed ,  YUNUS, Mohammad ,  SUMINTO, James, T.

IPC: G01L9/00

CPC classification number: B81B7/0058 ,  B81C1/00888 ,  B81C2201/053 ,  G01L9/0055 ,  H01L21/78

Abstract: A Micro-Electro-Mechanical System (MEMS) pressure sensor is disclosed, comprising a gauge wafer, comprising a micromachined structure comprising a membrane region and a pedestal region, wherein a first surface of the micromachined structure is configured to be exposed to a pressure medium that exerts a pressure resulting in a deflection of the membrane region. The gauge wafer also comprises a plurality of sensing elements patterned on the electrical insulation layer on a second surface in the membrane region, wherein a thermal expansion coefficient of the material of the sensing elements substantially matches with a thermal expansion coefficient of the material of the gauge wafer. The pressure sensor comprises a cap wafer coupled to the gauge wafer, which includes a recess on an inner surface of the cap wafer facing the gauge wafer that defines a sealed reference cavity that encloses and prevents exposure of the sensing elements to an external environment.

Abstract translation: 公开了一种微机电系统（MEMS）压力传感器，其包括量规晶片，其包括微加工结构，其包括膜区域和基座区域，其中微机械加工结构的第一表面被配置为暴露于压力介质 其施加导致膜区域偏转的压力。 测量晶片还包括在膜区域中的第二表面上在电绝缘层上图案化的多个感测元件，其中感测元件的材料的热膨胀系数基本上与量规材料的热膨胀系数相匹配 晶圆。 压力传感器包括联接到量规晶片的盖子晶片，其包括位于盖晶片的内表面上的面向量规晶片的凹槽，该凹槽限定密封的参考腔，其封闭并防止感测元件暴露于外部环境。

公开(公告)号：WO2013078006A1

公开(公告)日：2013-05-30

申请号：PCT/US2012/063901

申请日：2012-11-07

Applicant: S3C, INC.

Inventor： NZEADIBE, Ihioma, U. ,  HUSSAIN, Javed ,  CASTAGNA, Joseph ,  YUAN, Li ,  HORTON, Roger

IPC: H01L29/84

CPC classification number: G01L23/26 ,  F02D35/023 ,  F02D2400/22 ,  G01L19/0084

Abstract: The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.

Abstract translation: 所公开的本发明提供了用于各种实现的坚固，紧凑的感测装置，包括在内燃机过程中需要低成本精确的压力感测的汽车，船舶和其他燃烧技术的那些。 在本发明的一个或多个方面中，提出了具有柔性电路的MEMS传感器连接，并且其通信优选通过使用引线键合技术实现。

公开(公告)号：EP2783395A1

公开(公告)日：2014-10-01

申请号：EP12851847.9

申请日：2012-11-07

Applicant: S3C, Inc.

Inventor： NZEADIBE, Ihioma, U. ,  HUSSAIN, Javed ,  CASTAGNA, Joseph ,  YUAN, Li ,  HORTON, Roger

IPC: H01L29/84

CPC classification number: G01L23/26 ,  F02D35/023 ,  F02D2400/22 ,  G01L19/0084

Abstract: The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.

公开(公告)号：EP2567401A1

公开(公告)日：2013-03-13

申请号：EP11778212.8

申请日：2011-05-03

Applicant: S3C, Inc.

Inventor： HORTON, Roger ,  HUSSAIN, Javed

IPC: H01L23/58

CPC classification number: B81B7/0058 ,  B81C1/00888 ,  B81C2201/053 ,  G01L9/0055 ,  H01L21/78

Abstract: A method for separating a plurality of dies on a Micro-Electro-Mechanical System (MEMS) wafer comprising scribing a notch on a first side of the wafer between at least two of the plurality of dies on a first surface and depositing a metal on the first surface of the plurality of dies. The method further comprises scribing a second side of the wafer between at least two of the plurality of dies from a second surface thereof through the notch. The first side and second side are substantially parallel and opposite each other and the first surface and the second surface are substantially parallel and opposite each other. In a process in accordance with the present invention, a method to minimize chipping of the bonding portion of a MEMs device during sawing of the wafer is provided, which minimally affects the process steps associated with separating the die on a wafer.