中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

5 records (took 0.024 seconds)

    Thermally conductive material in hydrophobic compound for thermal management
    1.
    发明专利
    Thermally conductive material in hydrophobic compound for thermal management 审中-公开
    用于热管理的疏水化合物中的导热材料

    公开(公告)号：JP2006241470A

    公开(公告)日：2006-09-14

    申请号：JP2006135616

    申请日：2006-05-15

    Applicant: Saint-Gobain Ceramics & Plastics Inc ,  サン−ゴバン セラミックス アンド プラスティクス,インコーポレイティド

    Inventor： BOWSER SUSAN E ,  CLERE THOMAS M

    IPC: C08L101/00 ,  C09K5/08 ,  C08K9/04 ,  C08K9/06 ,  H01L23/373

    CPC classification number: H01L23/3737 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32245

    Abstract: PROBLEM TO BE SOLVED: To relate to modified thermally conductive powder or particles having hydrophobic coating layer substantially on the whole surface and to provide a moisture-resistant thermally conductive material. SOLUTION: A moisture resistant thermally conductive material comprising a particulate filler comprising thermally conductive particles having a hydrophobic compound coating and a binder effective to join together the filler particles. The present invention also includes an electronic apparatus comprising a heat source (12), a heat sink (14), and a layer (16) of the moisture resistant, thermally conductive interface material disposed between and in contact with the heat source (12) and the heat sink (14). Still, the present invention is directed to a moisture resistant, thermally conductive material comprising particles of agglomerated boron nitride having a hydrophobic compound coating. Yet, the present invention includes a method of removing heat from a heat source comprising providing a heat sink proximate the heat source and disposing a layer of the moisture resistant, thermally conductive material between and in contact with the heat source and the heat sink. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：涉及基本上在整个表面上具有疏水涂层的改性导热粉末或颗粒，并提供耐湿导热材料。 解决方案：一种防潮导热材料，其包含颗粒填料，其包括具有疏水化合物涂层和有效地将填料颗粒接合在一起的粘合剂的导热颗粒。 本发明还包括一种电子设备，其包括热源（12），散热器（14）和设置在热源（12）之间并与其接触的防潮导热界面材料层（16） 和散热片（14）。 仍然，本发明涉及一种防潮导热材料，其包含具有疏水化合物涂层的附聚氮化硼颗粒。 然而，本发明包括从热源除去热量的方法，包括提供靠近热源的散热器，并且在热源和散热器之间和与热源接触之间设置一层防潮导热材料。 版权所有（C）2006，JPO＆NCIPI

    Thermally conductive materials in a hydrophobic compound for thermal management
    2.
    发明专利
    Thermally conductive materials in a hydrophobic compound for thermal management 未知

    公开(公告)号：GB2370040A

    公开(公告)日：2002-06-19

    申请号：GB0204971

    申请日：2000-09-20

    Applicant: SAINT GOBAIN CERAMICS

    Inventor： BOWSER SUSAN E ,  CLERE THOMAS M

    IPC: C09K5/08 ,  C08K9/04 ,  C08L101/00 ,  H01L23/373 ,  B32B5/16 ,  C08K5/5415 ,  C08K9/06 ,  C08K9/08 ,  H01L23/28 ,  H05K1/03 ,  H05K3/00

    Abstract: The present invention is directed to a moisture resistant, thermally conductive material (16) comprising a particulate filler comprising thermally conductive particles having a hydrophobic compound coating and a binder effective to join together the filler particles. The present invention also includes an electronic apparatus comprising a heat source (12), a heat sink (14), and a layer (16) of the moisture resistant, thermally conductive interface material disposed between and in contact with the heat source (12) and the heat sink (14). Still, the present invention is directed to a moisture resistant, thermally conductive material comprising particles of agglomerated boron nitride having a hydrophobic compound coating. Yet, the present invention includes a method of removing heat from a heat source comprising providing a heat sink proximate the heat source and disposing a layer of the moisture resistant, thermally conductive material between and in contact with the heat source and the heat sink.

Patent Agency Ranking