Thermally conductive material in hydrophobic compound for thermal management
    2.
    发明专利
    Thermally conductive material in hydrophobic compound for thermal management 审中-公开
    用于热管理的疏水化合物中的导热材料

    公开(公告)号:JP2006241470A

    公开(公告)日:2006-09-14

    申请号:JP2006135616

    申请日:2006-05-15

    Abstract: PROBLEM TO BE SOLVED: To relate to modified thermally conductive powder or particles having hydrophobic coating layer substantially on the whole surface and to provide a moisture-resistant thermally conductive material. SOLUTION: A moisture resistant thermally conductive material comprising a particulate filler comprising thermally conductive particles having a hydrophobic compound coating and a binder effective to join together the filler particles. The present invention also includes an electronic apparatus comprising a heat source (12), a heat sink (14), and a layer (16) of the moisture resistant, thermally conductive interface material disposed between and in contact with the heat source (12) and the heat sink (14). Still, the present invention is directed to a moisture resistant, thermally conductive material comprising particles of agglomerated boron nitride having a hydrophobic compound coating. Yet, the present invention includes a method of removing heat from a heat source comprising providing a heat sink proximate the heat source and disposing a layer of the moisture resistant, thermally conductive material between and in contact with the heat source and the heat sink. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:涉及基本上在整个表面上具有疏水涂层的改性导热粉末或颗粒,并提供耐湿导热材料。 解决方案:一种防潮导热材料,其包含颗粒填料,其包括具有疏水化合物涂层和有效地将填料颗粒接合在一起的粘合剂的导热颗粒。 本发明还包括一种电子设备,其包括热源(12),散热器(14)和设置在热源(12)之间并与其接触的防潮导热界面材料层(16) 和散热片(14)。 仍然,本发明涉及一种防潮导热材料,其包含具有疏水化合物涂层的附聚氮化硼颗粒。 然而,本发明包括从热源除去热量的方法,包括提供靠近热源的散热器,并且在热源和散热器之间和与热源接触之间设置一层防潮导热材料。 版权所有(C)2006,JPO&NCIPI

    HIGHLY DELAMINATED HEXAGONAL BORON NITRIDE POWDERS, PROCESS FOR MAKING, AND USES THEREOF
    5.
    发明申请
    HIGHLY DELAMINATED HEXAGONAL BORON NITRIDE POWDERS, PROCESS FOR MAKING, AND USES THEREOF 审中-公开
    高度分层的六方硼酸盐粉,其制造方法及其用途

    公开(公告)号:WO0183371A3

    公开(公告)日:2002-03-21

    申请号:PCT/US0114041

    申请日:2001-05-01

    Inventor: CLERE THOMAS M

    Abstract: The present invention relates to a powder comprising boron nitride particles having an aspect ratio of from about 50 to about 300. The present invention also relates to a method of making delaminated boron nitride powder. This method involves providing boron nitride powder and milling the boron nitride powder in a mixture including a milling media and a milling liquid under conditions effective to produce delaminated boron nitride powder. Another aspect of the present invention is a method for extruding a molten polymer. This method involves blending a powder comprising hexagonal boron nitride particles having an aspect ratio of from about 50 to about 300 with a polymer to form a blend and extruding the blend through an extruder under conditions effective to disperse the boron nitride particles throughout the polymer to form an extrusion product.

    Abstract translation: 本发明涉及包含长径比为约50至约300的氮化硼颗粒的粉末。本发明还涉及一种制备分层的氮化硼粉末的方法。 该方法涉及在有效产生分层氮化硼粉末的条件下,提供氮化硼粉末并在含有研磨介质和研磨液体的混合物中研磨氮化硼粉末。 本发明的另一方面是一种挤出熔融聚合物的方法。 该方法包括将包含具有约50至约300的纵横比的六方氮化硼颗粒的粉末与聚合物共混以形成共混物,并在有效地将氮化硼颗粒分散在整个聚合物中的条件下通过挤出机挤出共混物以形成 挤出产品。

    6.
    发明专利
    未知

    公开(公告)号:DE60134970D1

    公开(公告)日:2008-09-04

    申请号:DE60134970

    申请日:2001-05-01

    Abstract: The present invention relates to a powder comprising boron nitride particles having an aspect ratio of from about 50 to about 300. The present invention also relates to a method of making delaminated boron nitride powder. This method involves providing boron nitride powder and milling the boron nitride powder in a mixture including a milling media and a milling liquid under conditions effective to produce delaminated boron nitride powder.

    Thermally conductive materials in a hydrophobic compound for thermal management

    公开(公告)号:GB2370040A

    公开(公告)日:2002-06-19

    申请号:GB0204971

    申请日:2000-09-20

    Abstract: The present invention is directed to a moisture resistant, thermally conductive material (16) comprising a particulate filler comprising thermally conductive particles having a hydrophobic compound coating and a binder effective to join together the filler particles. The present invention also includes an electronic apparatus comprising a heat source (12), a heat sink (14), and a layer (16) of the moisture resistant, thermally conductive interface material disposed between and in contact with the heat source (12) and the heat sink (14). Still, the present invention is directed to a moisture resistant, thermally conductive material comprising particles of agglomerated boron nitride having a hydrophobic compound coating. Yet, the present invention includes a method of removing heat from a heat source comprising providing a heat sink proximate the heat source and disposing a layer of the moisture resistant, thermally conductive material between and in contact with the heat source and the heat sink.

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