公开(公告)号：JP2001089756A

公开(公告)日：2001-04-03

申请号：JP2000208488

申请日：2000-07-10

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： DUVALL JAMES H ,  BERGERON STEVE ,  BALIAN CHARLES ,  ROGOVE ARTHUR H

IPC: C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K5/05 ,  C08K5/09 ,  C08K5/10 ,  C08K5/5419 ,  C08K7/00 ,  C08L7/00 ,  C08L9/00 ,  C08L25/00 ,  C08L33/00 ,  C08L77/00 ,  C08L83/04 ,  C08L91/06 ,  C08L101/00 ,  C09K5/06 ,  C09K5/08 ,  F28D20/02 ,  G06F1/20 ,  H01L23/373 ,  H01L23/427

Abstract: PROBLEM TO BE SOLVED: To provide a heat transfer material (A) for transferring heat from a heat source (12), such as a microprocessor, to a heat sink (14). SOLUTION: This transfer material comprises a heat-conductive filler dispersed in a phase change material. The phase change material is melted and fluidized at the operation temperature of a heat source, thereby well thermally bringing the non-smooth heat source into contact with the surface of a heat sink, and the transfer material is excessively not oozed or lost. The phase change material comprises a polymer, such as an elastomer, and a melting point component. The melting point material controls the softening point of the phase charge material to the operation temperature of the heat source.

公开(公告)号：DE60011346T2

公开(公告)日：2005-06-23

申请号：DE60011346

申请日：2000-07-07

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： DUVALL JAMES H ,  BERGERSON STEVE ,  BALIAN CHARLES ,  ROGOVE ARTHUR H

IPC: C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K5/05 ,  C08K5/09 ,  C08K5/10 ,  C08K5/5419 ,  C08K7/00 ,  C08L7/00 ,  C08L9/00 ,  C08L25/00 ,  C08L33/00 ,  C08L77/00 ,  C08L83/04 ,  C08L91/06 ,  C08L101/00 ,  C09K5/06 ,  C09K5/08 ,  F28D20/02 ,  G06F1/20 ,  H01L23/373 ,  H01L23/427

公开(公告)号：FR2840732B1

公开(公告)日：2006-03-03

申请号：FR0306875

申请日：2003-06-06

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： BALIAN CHARLES ,  BERGERSON STEVEN E ,  CURRIER GREGG C

IPC: H01L23/373 ,  C08K3/10 ,  C08L25/08 ,  C08L91/00 ,  C22C12/00 ,  C22C13/00 ,  H01L23/42 ,  H01L23/427

Abstract: A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The matrix comprises a viscoelastic composition which softens at about the operating temperature of the heat source. The viscoelastic composition may include a thermoplastic elastomer, a compatible hydrocarbon oil, and a tackifying resin. In use, the thermal interface composition flows under pressure between the heat source and the heat sink to make thermal contact between the two. When the heat source is operated and reaches operating temperature, the viscoelastic composition softens and the low melting alloy melts at around the operating temperature to form a highly thermally conductive, generally homogeneous mixture which readily transfers heat to the heat sink.

公开(公告)号：FR2840732A1

公开(公告)日：2003-12-12

申请号：FR0306875

申请日：2003-06-06

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： BALIAN CHARLES ,  BERGERSON STEVEN E ,  CURRIER GREGG C

IPC: H01L23/373 ,  H01L23/42 ,  H01L23/427 ,  C22C12/00 ,  C08L25/08 ,  C08L91/00 ,  C08K3/10 ,  C22C13/00

Abstract: A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The matrix comprises a viscoelastic composition which softens at about the operating temperature of the heat source. The viscoelastic composition may include a thermoplastic elastomer, a compatible hydrocarbon oil, and a tackifying resin. In use, the thermal interface composition flows under pressure between the heat source and the heat sink to make thermal contact between the two. When the heat source is operated and reaches operating temperature, the viscoelastic composition softens and the low melting alloy melts at around the operating temperature to form a highly thermally conductive, generally homogeneous mixture which readily transfers heat to the heat sink.

公开(公告)号：DE60011346D1

公开(公告)日：2004-07-15

申请号：DE60011346

申请日：2000-07-07

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： DUVALL JAMES H ,  BERGERSON STEVE ,  BALIAN CHARLES ,  ROGOVE ARTHUR H

IPC: C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K5/05 ,  C08K5/09 ,  C08K5/10 ,  C08K5/5419 ,  C08K7/00 ,  C08L7/00 ,  C08L9/00 ,  C08L25/00 ,  C08L33/00 ,  C08L77/00 ,  C08L83/04 ,  C08L91/06 ,  C08L101/00 ,  C09K5/06 ,  C09K5/08 ,  F28D20/02 ,  G06F1/20 ,  H01L23/373 ,  H01L23/427

公开(公告)号：DE10325332A1

公开(公告)日：2004-01-08

申请号：DE10325332

申请日：2003-06-04

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： BALIAN CHARLES ,  BERGERSON STEVEN E ,  CURRIER GREGG C

IPC: H01L23/373 ,  H01L23/42 ,  H01L23/427 ,  C09K5/06

Abstract: A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The matrix comprises a viscoelastic composition which softens at about the operating temperature of the heat source. The viscoelastic composition may include a thermoplastic elastomer, a compatible hydrocarbon oil, and a tackifying resin. In use, the thermal interface composition flows under pressure between the heat source and the heat sink to make thermal contact between the two. When the heat source is operated and reaches operating temperature, the viscoelastic composition softens and the low melting alloy melts at around the operating temperature to form a highly thermally conductive, generally homogeneous mixture which readily transfers heat to the heat sink.