公开(公告)号：JP2001089756A

公开(公告)日：2001-04-03

申请号：JP2000208488

申请日：2000-07-10

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： DUVALL JAMES H ,  BERGERON STEVE ,  BALIAN CHARLES ,  ROGOVE ARTHUR H

IPC: C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K3/38 ,  C08K5/05 ,  C08K5/09 ,  C08K5/10 ,  C08K5/5419 ,  C08K7/00 ,  C08L7/00 ,  C08L9/00 ,  C08L25/00 ,  C08L33/00 ,  C08L77/00 ,  C08L83/04 ,  C08L91/06 ,  C08L101/00 ,  C09K5/06 ,  C09K5/08 ,  F28D20/02 ,  G06F1/20 ,  H01L23/373 ,  H01L23/427

Abstract: PROBLEM TO BE SOLVED: To provide a heat transfer material (A) for transferring heat from a heat source (12), such as a microprocessor, to a heat sink (14). SOLUTION: This transfer material comprises a heat-conductive filler dispersed in a phase change material. The phase change material is melted and fluidized at the operation temperature of a heat source, thereby well thermally bringing the non-smooth heat source into contact with the surface of a heat sink, and the transfer material is excessively not oozed or lost. The phase change material comprises a polymer, such as an elastomer, and a melting point component. The melting point material controls the softening point of the phase charge material to the operation temperature of the heat source.