A MELT PROCESSABLE COMPOSITION AND METHOD OF MAKING
    1.
    发明申请
    A MELT PROCESSABLE COMPOSITION AND METHOD OF MAKING 审中-公开
    一种熔融加工组合物及其制备方法

    公开(公告)号:WO2013003758A3

    公开(公告)日:2013-04-11

    申请号:PCT/US2012045013

    申请日:2012-06-29

    CPC classification number: C08K5/3415 C08K5/0083 C08L27/16 C08L67/04

    Abstract: A composition includes a) a melt processable polymer including at least one chemical moiety having a partial charge; and b) a nucleating agent having a surface charge that is opposite the partial charge of the chemical moiety of the polymer, wherein the nucleating agent accelerates the rate of crystallization of the melt processable polymer; wherein the nucleating agent has a melting point greater than the melting point of the melt processable polymer. In an embodiment, a method of making the composition is also provided.

    Abstract translation: 组合物包括a)包含至少一个具有部分电荷的化学部分的可熔融加工的聚合物; 和b)具有与聚合物的化学部分的部分电荷相反的表面电荷的成核剂,其中成核剂加速可熔融加工的聚合物的结晶速率; 其中成核剂的熔点大于可熔融加工的聚合物的熔点。 在一个实施方案中,还提供了制备组合物的方法。

    METHOD OF MANUFACTURING LIGHT EMITTING DEVICE

    公开(公告)号:SG11201405896TA

    公开(公告)日:2014-11-27

    申请号:SG11201405896T

    申请日:2012-09-04

    Abstract: A novel method of producing an encapsulated light emitting device. A preferred mold release film that can be used during the encapsulation of a LED chip has an elastic modulus and a glass transition temperature that are low enough as compared to the desired molding temperature that the release film will closely conform to the interior of the molding cavities used to form a protective lens surrounding an LED chip. A preferred release film according to embodiments of the present invention comprises a fully fluorinated polymer, such as a perfluoroalkoxy polymer, including MFA, or fluorinated ethylene propylene.

    METHOD OF MANUFACTURING LIGHT EMITTING DEVICE

    公开(公告)号:SG10201608345RA

    公开(公告)日:2016-11-29

    申请号:SG10201608345R

    申请日:2012-09-04

    Abstract: A novel method of producing an encapsulated light emitting device. A preferred mold release film that can be used during the encapsulation of a LED chip has an elastic modulus and a glass transition temperature that are low enough as compared to the desired molding temperature that the release film will closely conform to the interior of the molding cavities used to form a protective lens surrounding an LED chip. A preferred release film according to embodiments of the present invention comprises a fully fluorinated polymer, such as a perfluoroalkoxy polymer, including MFA, or fluorinated ethylene propylene.

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