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公开(公告)号：SG11201405896TA
公开(公告)日：2014-11-27
申请号：SG11201405896T
申请日：2012-09-04
Applicant: SAINT GOBAIN PERFORMANCE PLAST
Inventor： BRAVET DAVID , ADAMKO MICHAEL A
IPC: H01L33/48
Abstract: A novel method of producing an encapsulated light emitting device. A preferred mold release film that can be used during the encapsulation of a LED chip has an elastic modulus and a glass transition temperature that are low enough as compared to the desired molding temperature that the release film will closely conform to the interior of the molding cavities used to form a protective lens surrounding an LED chip. A preferred release film according to embodiments of the present invention comprises a fully fluorinated polymer, such as a perfluoroalkoxy polymer, including MFA, or fluorinated ethylene propylene.
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公开(公告)号：ES2161445T3
公开(公告)日：2001-12-01
申请号：ES97907974
申请日：1997-03-03
Applicant: SAINT GOBAIN PERFORMANCE PLAST
Inventor： ADAMKO MICHAEL A , FRIEDMAN MICHAEL , WALDENBERGER DEAN A
Abstract: A silicone-free release film comprises a linear ethylenic polymer having a density from 0.865 to 0.900 g/cc and an index of polydispersity of less than 5.0 and yields a maximum release force value of 39 g/cm at a film thickness of 0.10 to 0.15 mm in an adhesive peel test. The film is useful in manufacturing rolls and sheets of pressure-sensitive adhesive tape.
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3.发明公开METHOD OF MANUFACTURING LIGHT EMITTING DEVICE 审中-公开VERFAHREN ZUR HERSTELLUNG EINER LICHTEMITTIERENDEN VORRICHTUNG
公开(公告)号：EP2837040A4
公开(公告)日：2015-10-14
申请号：EP12874175
申请日：2012-09-04
Applicant: SAINT GOBAIN PERFORMANCE PLAST
Inventor： BRAVET DAVID , ADAMKO MICHAEL A
CPC classification number: B29C33/68 , B29C33/62 , B29C37/0075 , B29C39/006 , B29C45/14016 , B29C45/14639 , B29C2045/0075 , B29C2045/14155 , B29C2045/1477 , B29D11/00807 , B29L2011/0016 , B29L2031/34 , C08J5/18 , C08J2327/18 , C08J2327/20 , C08J2329/10 , H01L24/97 , H01L25/0753 , H01L33/54 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2933/005 , Y10T428/24355 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A novel method of producing an encapsulated light emitting device. A preferred mold release film that can be used during the encapsulation of a LED chip has an elastic modulus and a glass transition temperature that are low enough as compared to the desired molding temperature that the release film will closely conform to the interior of the molding cavities used to form a protective lens surrounding an LED chip. A preferred release film according to embodiments of the present invention comprises a fully fluorinated polymer, such as a perfluoroalkoxy polymer, including MFA, or fluorinated ethylene propylene.
Abstract translation: 一种制造封装发光器件的新颖方法。 可以在封装LED芯片期间使用的优选的脱模膜具有与所需的模制温度相比足够低的弹性模量和玻璃化转变温度，所述模制温度与剥离膜将紧密地配合到模腔内部 用于形成围绕LED芯片的保护透镜。 根据本发明实施方案的优选的脱模膜包含全氟化聚合物，例如全氟烷氧基聚合物，包括MFA或氟化乙烯丙烯。
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公开(公告)号：SG10201608345RA
公开(公告)日：2016-11-29
申请号：SG10201608345R
申请日：2012-09-04
Applicant: SAINT GOBAIN PERFORMANCE PLAST
Inventor： BRAVET DAVID , ADAMKO MICHAEL A
Abstract: A novel method of producing an encapsulated light emitting device. A preferred mold release film that can be used during the encapsulation of a LED chip has an elastic modulus and a glass transition temperature that are low enough as compared to the desired molding temperature that the release film will closely conform to the interior of the molding cavities used to form a protective lens surrounding an LED chip. A preferred release film according to embodiments of the present invention comprises a fully fluorinated polymer, such as a perfluoroalkoxy polymer, including MFA, or fluorinated ethylene propylene.
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