Abstract:
An optoelectronic structure can include a liquid crystal polymer layer and an optoelectronic device adjacent to a first surface of the liquid crystal polymer layer. The liquid crystal polymer layer can include the first surface and a second surface opposite the first surface. In an embodiment, the liquid crystal polymer layer can further include a liquid crystal polymer at least partially exposed to a gas at the second surface. In another embodiment, the liquid crystal polymer may be a thermotropic liquid crystal polymer. In still another embodiment, the polymer layer can include an additive to reduce migration of a gas through the polymer layer. Methods of forming such optoelectronic structures can include melt-processing techniques.
Abstract:
A method includes casting a friction reducing layer on a carrier, and casting an adhesive layer overlying the friction reducing layer to form a multilayer cast film. The method further includes laminating the multilayer cast film to the load bearing substrate with the load bearing substrate to form a composite and shaping the composite. The load bearing substrate is closer to the adhesive layer than to the friction reducing layer.
Abstract:
A multilayer construct includes a fluoropolymer first layer; a UV resistant fluoropolymer adhesive layer, and a third layer, wherein the fluoropolymer adhesive layer is between the first and third layers. The adhesive layer can optionally include an ultraviolet radiation absorber.
Abstract:
A method includes casting a friction reducing layer on a carrier, and casting an adhesive layer overlying the friction reducing layer to form a multilayer cast film. The method further includes laminating the multilayer cast film to the load bearing substrate with the load bearing substrate to form a composite and shaping the composite. The load bearing substrate is closer to the adhesive layer than to the friction reducing layer.
Abstract:
A method includes casting a friction reducing layer on a carrier, and casting an adhesive layer overlying the friction reducing layer to form a multilayer cast film. The method further includes laminating the multilayer cast film to the load bearing substrate with the load bearing substrate to form a composite and shaping the composite. The load bearing substrate is closer to the adhesive layer than to the friction reducing layer.
Abstract:
Un método incluye moldear una capa reductora de la fricción sobre un soporte, y moldear una capa de adhesivo que cubre la capa reductora de la fricción para formar una película moldeada de múltiples capas. El método incluye además laminar la película moldeada de múltiples capas al sustrato que soporta carga con el sustrato que soporta carga para formar un material compuesto, o conformar el material compuesto. El sustrato que soporta carga está más cerca de la capa de adhesivo que de la capa reductora de la fricción.