Abstract:
A multilayer film includes a functional portion including one or more layers, an adhesive layer overlying a major surface of the functional portion, and a fluoropolymer layer overlying a major surface of the adhesive layer opposite the functional portion. The fluoropolymer layer includes a fluoropolymer. The adhesive layer includes an adhesive and an ultraviolet radiation absorber.
Abstract:
A bushing can include a load bearing substrate having a first major surface, an adhesive film overlying the first major surface, and a friction reducing layer overlying the adhesive film. A method can include extruding an adhesive film, laminating a friction reducing layer to a load bearing substrate with the adhesive film therebetween to form a composite, and shaping the composite to form a bushing. The adhesive film can include a first adhesive layer, such as and a fluoropolymer layer. The adhesive layer can include a modified ethylene tetrafluoroethylene, and the fluoropolymer layer can include an ethylene tetrafluoroethylene.
Abstract:
The disclosure is directed to a laminate structure including an encapsulant layer and a thermoplastic polymer layer. The encapsulant layer has a major surface, wherein the major surface of the encapsulant is treated to increase adhesion. The thermoplastic polymer layer has a melting point temperature or glass transition temperature greater than about 16°C, wherein the thermoplastic layer has a major surface that is treated to increase adhesion and is disposed on the treated major surface of the encapsulant layer. The disclosure is further directed to a method of forming the aforementioned laminate structure.
Abstract:
A multilayer film includes a functional portion including one or more layers, an adhesive layer overlying a major surface of the functional portion, and a fluoropolymer layer overlying a major surface of the adhesive layer opposite the functional portion. The fluoropolymer layer includes a fluoropolymer. The adhesive layer includes an adhesive and an ultraviolet radiation absorber.
Abstract:
The disclosure is directed to a laminate structure including an encapsulant layer and a thermoplastic polymer layer. The encapsulant layer has a major surface, wherein the major surface of the encapsulant is treated to increase adhesion. The thermoplastic polymer layer has a melting point temperature or glass transition temperature greater than about 16°C, wherein the thermoplastic layer has a major surface that is treated to increase adhesion and is disposed on the treated major surface of the encapsulant layer. The disclosure is further directed to a method of forming the aforementioned laminate structure.