公开(公告)号：WO2007095521A3

公开(公告)日：2007-11-22

申请号：PCT/US2007062032

申请日：2007-02-13

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： SWEI GWO ,  KASTELIC JOHN R ,  TUKACHINSKY ALEXANDER

IPC: B32B25/08 ,  B32B27/08

CPC classification number: B32B27/08 ,  B32B25/08 ,  B32B25/14 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B2270/00 ,  B32B2307/54 ,  B32B2307/704 ,  Y10T428/2495 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31826 ,  Y10T428/31931 ,  Y10T428/31938

Abstract: A multi-layer film includes a first layer including a blend of diene elastomer and not greater than about 40% by weight polyolefm. The multi-layer film also includes a second layer directly contacting and directly bonded to the first layer. The second layer includes a fluoropolymer.

Abstract translation: 多层膜包括包含二烯弹性体和不大于约40重量％聚烯烃的共混物的第一层。 多层膜还包括与第一层直接接触并直接结合的第二层。 第二层包含含氟聚合物。

公开(公告)号：WO2007100732A3

公开(公告)日：2007-10-25

申请号：PCT/US2007004851

申请日：2007-02-23

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： SWEI GWO SHIN ,  KASTELIC JOHN R

IPC: B32B25/08 ,  B32B27/08

CPC classification number: B32B25/14 ,  B32B25/08 ,  B32B27/304 ,  B32B27/322 ,  B32B2250/24 ,  B32B2270/00 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31826 ,  Y10T428/31833

Abstract: A multilayer film including a first layer including a curable elastomer and a second layer bonded directly to and directly contacting the first layer. The second layer includes a fluoropolymer and has a thickness less than 5.0 microns. The multilayer film has a thickness ratio of at least about 5. The thickness ratio is a ratio of the thickness of the first layer to the thickness of the second layer. The multilayer film has generally parallel and planar opposite major surfaces.

Abstract translation: 一种多层膜，包括含有可固化弹性体的第一层和直接与第一层接触并直接接触第二层。 第二层包含含氟聚合物并具有小于5.0微米的厚度。 多层膜具有至少约5的厚度比。厚度比是第一层的厚度与第二层的厚度的比率。 多层膜通常具有平行且平面相对的主表面。

公开(公告)号：WO2007103011A3

公开(公告)日：2008-03-13

申请号：PCT/US2007004850

申请日：2007-02-23

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： SWEI GWO SHIN ,  KASTELIC JOHN R ,  ORTIZ PAUL W

IPC: H05K3/28 ,  H05K1/00

CPC classification number: H05K3/281 ,  H05K1/0393 ,  H05K2203/068

Abstract: A method for forming a flexible circuit board includes placing an adhesive coated coverlay (104) over a flexible media (102), placing a release film over the adhesive coated coverlay and compressing together the flexible media, the adhesive coated coverlay, and the release film. The flexible media includes circuitry (110). The release film includes a multi-layer film having first and second layers. The first layer includes an elastomer and the second layer includes a f luoropolymer.

Abstract translation: 一种用于形成柔性电路板的方法，包括将粘合剂涂覆的覆盖物（104）放置在柔性介质（102）上，将剥离膜放置在粘合剂涂覆的覆盖物上并将柔性介质，粘合剂涂覆的覆盖物和脱模膜 。 柔性介质包括电路（110）。 剥离膜包括具有第一层和第二层的多层膜。 第一层包括弹性体，第二层包括氟聚合物。