公开(公告)号：WO2012040591A3

公开(公告)日：2012-06-07

申请号：PCT/US2011053009

申请日：2011-09-23

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： HETZLER KEVIN G ,  MCCOY JESSICA L ,  CONLEY KAREN M ,  DICORLETO GIBSON JULIA ,  LEMBERGER MICHAEL J

IPC: B32B27/08 ,  B32B27/16 ,  B32B27/28

CPC classification number: B32B7/12 ,  B32B7/02 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/304 ,  B32B27/306 ,  B32B27/32 ,  B32B27/322 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2307/414 ,  B32B2307/554 ,  B32B2307/712 ,  B32B2307/7246 ,  B32B2457/12 ,  H01L31/0481 ,  H01L31/049 ,  Y02E10/50 ,  Y10T156/10 ,  Y10T428/31507 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: The disclosure is directed to a laminate structure including an encapsulant layer and a thermoplastic polymer layer. The encapsulant layer has a major surface, wherein the major surface of the encapsulant is treated to increase adhesion. The thermoplastic polymer layer has a melting point temperature or glass transition temperature greater than about 16°C, wherein the thermoplastic layer has a major surface that is treated to increase adhesion and is disposed on the treated major surface of the encapsulant layer. The disclosure is further directed to a method of forming the aforementioned laminate structure.

Abstract translation: 本公开涉及包括密封剂层和热塑性聚合物层的层压结构。 密封剂层具有主表面，其中处理密封剂的主表面以增加附着力。 热塑性聚合物层具有大于约16℃的熔点温度或玻璃化转变温度，其中热塑性层具有被处理以增加粘附力的主表面并且设置在密封剂层的经处理的主表面上。 本公开进一步涉及形成上述层叠结构的方法。

公开(公告)号：SG189029A1

公开(公告)日：2013-05-31

申请号：SG2013020615

申请日：2011-09-23

Applicant: SAINT GOBAIN PERFORMANCE PLAST

Inventor： HETZLER KEVIN G ,  MCCOY JESSICA L ,  CONLEY KAREN M ,  DICORLETO GIBSON JULIA ,  LEMBERGER MICHAEL J

Abstract: The disclosure is directed to a laminate structure including an encapsulant layer and a thermoplastic polymer layer. The encapsulant layer has a major surface, wherein the major surface of the encapsulant is treated to increase adhesion. The thermoplastic polymer layer has a melting point temperature or glass transition temperature greater than about 16°C, wherein the thermoplastic layer has a major surface that is treated to increase adhesion and is disposed on the treated major surface of the encapsulant layer. The disclosure is further directed to a method of forming the aforementioned laminate structure.