公开(公告)号：WO2021207390A1

公开(公告)日：2021-10-14

申请号：PCT/US2021/026226

申请日：2021-04-07

Applicant: SAMTEC, INC.

Inventor： BEST, Burrell G. ,  VICICH, Brian R. ,  MEREDITH, Kevin R. ,  FAITH, Chadrick P. ,  NOVAK, Istvan ,  BUCK, Jonathan E.

IPC: H05K7/14 ,  H05K3/34 ,  H01R12/71 ,  H01R13/53 ,  H01R13/658

Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.