公开(公告)号：WO2019191621A1

公开(公告)日：2019-10-03

申请号：PCT/US2019/024891

申请日：2019-03-29

Applicant: SAMTEC, INC.

Inventor： NOLET, Alan ,  GOIA, Daniel ,  HARDIKAR, Vishwas ,  KUMAR, Ajeet ,  LONG, Daniel ,  LIOTTA, Andrew

IPC: H01L23/498 ,  H01L23/15 ,  H01L23/525

Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

公开(公告)号：WO2019191621A4

公开(公告)日：2019-10-03

申请号：PCT/US2019/024891

申请日：2019-03-29

Applicant: SAMTEC, INC.

Inventor： NOLET, Alan ,  GOIA, Daniel ,  HARDIKAR, Vishwas ,  KUMAR, Ajeet ,  LONG, Daniel ,  LIOTTA, Andrew

IPC: H01L23/498 ,  H01L23/15 ,  H01L23/525

Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

公开(公告)号：WO2021067330A2

公开(公告)日：2021-04-08

申请号：PCT/US2020/053363

申请日：2020-09-30

Applicant: SAMTEC, INC.

Inventor： NOLET, Alan, D. ,  LIOTTA, Andrew, Haynes ,  HOLLAND, Troy, Benton ,  HAMMANN, Thomas, Jacob ,  BATES, Heidi ,  GOIA, Daniel ,  HARDIKAR, Vishwas, Vnayak ,  KUMAR, Ajeet ,  LONG, Daniel ,  MCGRAW, Nicole ,  MOEN, Lauren, Savawn ,  OWENS, Adam

IPC: H01L23/498 ,  H01L23/15 ,  H01L21/48 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/5384

Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

公开(公告)号：EP4042479A2

公开(公告)日：2022-08-17

申请号：EP20872452.6

申请日：2020-09-30

Applicant: Samtec Inc.

Inventor： NOLET, Alan, D. ,  LIOTTA, Andrew, Haynes ,  HOLLAND, Troy, Benton ,  HAMMANN, Thomas, Jacob ,  BATES, Heidi ,  GOIA, Daniel ,  HARDIKAR, Vishwas, Vnayak ,  KUMAR, Ajeet ,  LONG, Daniel ,  MCGRAW, Nicole ,  MOEN, Lauren, Savawn ,  OWENS, Adam

IPC: H01L23/498 ,  H01L23/15 ,  H01L21/48