公开(公告)号：WO2022217146A1

公开(公告)日：2022-10-13

申请号：PCT/US2022/024275

申请日：2022-04-11

Applicant: SAMTEC, INC.

Inventor： BOHN, Christopher David ,  CRAIN, Mark ,  ROEHM, Justin ,  HAMMANN, Thomas Jacob ,  ROBERTSON, Nathan ,  BROWN, Jeremy ,  PELKEY, Christopher ,  OWENS, Adam ,  PAYTON, Russell ,  FRANK, Russell

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/00

Abstract: A substrate is provided that includes a substrate body made of a material such as glass, and at least one electrical via that can extend at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.

公开(公告)号：EP4305666A1

公开(公告)日：2024-01-17

申请号：EP22767954.5

申请日：2022-03-10

Applicant: Samtec Inc.

Inventor： HAMMANN, Thomas, Jacob ,  OWENS, Adam ,  BOHN, Christopher ,  HAGAN, Nathan ,  ROBERTSON, Nathan ,  WRSHKA, Peter

IPC: H01L23/48 ,  H01L23/15 ,  H01L23/00

公开(公告)号：WO2022192485A1

公开(公告)日：2022-09-15

申请号：PCT/US2022/019670

申请日：2022-03-10

Applicant: SAMTEC, INC.

Inventor： HAMMANN, Thomas, Jacob ,  OWENS, Adam ,  BOHN, Christopher ,  HAGAN, Nathan ,  ROBERTSON, Nathan ,  WRSHKA, Peter

IPC: H01L23/48 ,  H01L23/15 ,  H01L23/00

Abstract: Electrically conductive pastes are disclosed that are configured to fill a hole in a substrate. The paste can be cured in the hole so as to define an electrically conductive metallized via. Fills that perform at high temperatures are also disclosed.

公开(公告)号：WO2021067330A2

公开(公告)日：2021-04-08

申请号：PCT/US2020/053363

申请日：2020-09-30

Applicant: SAMTEC, INC.

Inventor： NOLET, Alan, D. ,  LIOTTA, Andrew, Haynes ,  HOLLAND, Troy, Benton ,  HAMMANN, Thomas, Jacob ,  BATES, Heidi ,  GOIA, Daniel ,  HARDIKAR, Vishwas, Vnayak ,  KUMAR, Ajeet ,  LONG, Daniel ,  MCGRAW, Nicole ,  MOEN, Lauren, Savawn ,  OWENS, Adam

IPC: H01L23/498 ,  H01L23/15 ,  H01L21/48 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/5384

Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

公开(公告)号：EP4042479A2

公开(公告)日：2022-08-17

申请号：EP20872452.6

申请日：2020-09-30

Applicant: Samtec Inc.

Inventor： NOLET, Alan, D. ,  LIOTTA, Andrew, Haynes ,  HOLLAND, Troy, Benton ,  HAMMANN, Thomas, Jacob ,  BATES, Heidi ,  GOIA, Daniel ,  HARDIKAR, Vishwas, Vnayak ,  KUMAR, Ajeet ,  LONG, Daniel ,  MCGRAW, Nicole ,  MOEN, Lauren, Savawn ,  OWENS, Adam

IPC: H01L23/498 ,  H01L23/15 ,  H01L21/48