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    ELECTRIC CONNECTION COVER FOR HYDRAULIC PRESSURE COMPONENT HOUSING UTILIZING LEAKAGE-STOPPED PRINTED WIRING BOARD
    1.
    发明专利
    ELECTRIC CONNECTION COVER FOR HYDRAULIC PRESSURE COMPONENT HOUSING UTILIZING LEAKAGE-STOPPED PRINTED WIRING BOARD 审中-公开

    公开(公告)号：JP2003152355A

    公开(公告)日：2003-05-23

    申请号：JP2002227599

    申请日：2002-08-05

    Applicant: SAUER DANFOSS INC

    Inventor： BERGHERR THOMAS J ,  FISCHBACH JOHN

    IPC: F04B53/00 ,  H05K5/00 ,  H05K5/06 ,  H05K7/14

    Abstract: PROBLEM TO BE SOLVED: To provide an electric connection cover for hydraulic pressure component housing utilizing a leakage-stopped printed wiring board for eliminating the leak of fluid from a hydraulic pressure component housing. SOLUTION: An electronic connection cover 10 for a hydraulic component 12 has a housing structure having an interior compartment 14 and an electronic control element 18 in the interior compartment. The housing structure has a face for interfacing a hydrostatic component housing. A printed wiring board 26 is fixed to the face of the housing structure with a printed wiring circuit on the side thereof opposite to the housing structure. The printed wiring circuit is connected to the electronic control element. Electrical contacts extend from the printed wiring circuit through the printed wiring board and the electronic connection cover 24 for an external connection to an exterior circuit. A seal element 38 is located between the printed wiring board and the electronic control circuit, and surrounds an area where the electrical contacts extend through the printed wiring board.

    2.
    发明专利
    未知

    公开(公告)号：DE10235228A1

    公开(公告)日：2003-03-06

    申请号：DE10235228

    申请日：2002-08-01

    Applicant: SAUER DANFOSS INC

    Inventor： BERGHERR THOMAS J ,  FISCHBACH JOHN

    IPC: F04B53/00 ,  H05K5/00 ,  H05K5/06 ,  H05K7/14

    Abstract: An electronic connection cover for a hydraulic component has a housing structure having an interior compartment and an electronic control element in the interior compartment. The housing structure has a face for interfacing a hydrostatic component housing. A printed circuit board is affixed to the face of the housing structure with a printed circuit thereon on a side thereof opposite to the housing structure. The printed circuit is connected to the electronic control element. Electrical contacts extend from the printed circuit through the printed circuit board and the electronic connection cover for external connection to an exterior circuit. A seal element is located between the printed circuit board and the electronic control circuit which surrounds the area where the electrical contacts extend through the printed circuit board.

    3.
    发明专利
    未知

    公开(公告)号：DE10235228B4

    公开(公告)日：2005-06-16

    申请号：DE10235228

    申请日：2002-08-01

    Applicant: SAUER DANFOSS INC

    Inventor： BERGHERR THOMAS J ,  FISCHBACH JOHN

    IPC: F04B53/00 ,  H05K5/00 ,  H05K5/06 ,  H05K7/14

    Abstract: An electronic connection cover for a hydraulic component has a housing structure having an interior compartment and an electronic control element in the interior compartment. The housing structure has a face for interfacing a hydrostatic component housing. A printed circuit board is affixed to the face of the housing structure with a printed circuit thereon on a side thereof opposite to the housing structure. The printed circuit is connected to the electronic control element. Electrical contacts extend from the printed circuit through the printed circuit board and the electronic connection cover for external connection to an exterior circuit. A seal element is located between the printed circuit board and the electronic control circuit which surrounds the area where the electrical contacts extend through the printed circuit board.

    5.
    发明专利
    未知

    公开(公告)号：DE102008058749A1

    公开(公告)日：2009-06-18

    申请号：DE102008058749

    申请日：2008-11-24

    Applicant: SAUER DANFOSS INC

    Inventor： YAN XIAO ,  BERGHERR THOMAS J

    IPC: H05K3/36 ,  H01R12/71 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

    Abstract: A method of manufacturing a circuit board assembly for a controller. The method includes providing first and second printed circuit boards wherein the first printed circuit board has a plurality of copper pads containing slots therein that correspond to a plurality of power tabs in the second printed circuit board. The power tabs are then slid into the slots and the tabs are flooded with copper. At this time the power tabs are soldered within the slots to provide an electrical connection between the first and second printed circuit boards that allows for the transfer of current between the boards of more than three amps.

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