PROCESSING LIQUID SUPPLY APPARATUS AND METHOD OF REMOVING SOLIDS FROM PROCESSING LIQUID SUPPLY APPARATUS

    公开(公告)号:US20220216072A1

    公开(公告)日:2022-07-07

    申请号:US17569463

    申请日:2022-01-05

    Inventor: Mu Hyeon LEE

    Abstract: Proposed herein are a processing liquid supply apparatus and a method of removing solids from the processing liquid supply apparatus. The proposed processing liquid supply apparatus has a flushing function for removing solids such as silica which are precipitated as a result of supplying a processing liquid from the processing liquid supply apparatus to a substrate processing apparatus. The processing liquid supply apparatus supplies the processing liquid to a substrate processing apparatus and then recovers and regenerates the processing liquid. The proposed method provides a method of removing solids such as solid silica from the processing liquid supply apparatus.

    APPARATUS AND METHOD OF TREATING SUBSTRATE
    2.
    发明公开

    公开(公告)号:US20230187232A1

    公开(公告)日:2023-06-15

    申请号:US18056491

    申请日:2022-11-17

    Inventor: Mu Hyeon LEE

    Abstract: Provided is a method of treating a substrate, the method comprising: heating a treatment liquid with a heater unit installed in a circulation line while circulating the treatment liquid in a housing of a tank through the circulation line coupled to the housing to adjust a temperature of the treatment liquid; evaporating water in the treatment liquid in the housing by heating the treatment liquid to a temperature higher than a temperature of water contained in the treatment liquid by the heater unit to adjust a concentration of a chemical liquid contained in the treatment liquid; and supplying the treatment liquid of which the temperature and the concentration are controlled to a substrate to treat the substrate, in which the evaporation of water from the treatment liquid stored in the housing is accelerated by supplying gas to the treatment liquid flowing through the circulation line.

    APPARATUS AND METHOD FOR SUPPLYING PROCESSING LIQUID

    公开(公告)号:US20220199432A1

    公开(公告)日:2022-06-23

    申请号:US17520481

    申请日:2021-11-05

    Inventor: Mu Hyeon LEE

    Abstract: A method for supplying processing liquid is configured to adjust the supply amount of silica by a processing liquid supply unit in order to improve a selectivity ratio in a substrate treatment process through the processing liquid, to mix processing liquid substances, to adjust the concentration and temperature of the processing liquid on the basis of a substrate processing condition to supply the processing liquid to a substrate processing apparatus, to recover the processing liquid through a processing liquid recycling unit spatially separated from a processing liquid supply unit and to adjust the concentration of moisture and temperature of the processing liquid, and to supply the recycled processing liquid.

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