公开(公告)号：AU2013204149A1

公开(公告)日：2013-05-02

申请号：AU2013204149

申请日：2013-04-12

Applicant: SENSORS FOR MEDICINE AND SCIENCE INC

Inventor： COLVIN JASON D ,  COLVIN ARTHUR E ,  DEHENNIS ANDREW ,  KRSMANOVIC JODY L

IPC: A61B5/00 ,  G01N21/64 ,  H01L25/16 ,  H01L33/44 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62

Abstract: 'uilu-ll Illu u tu l5 10p 4I utIn V SPCCIllClhIO1.d-I l/104//U3 A semiconductor device for harsh environments, comprising: a printed circuit board having a top surface with a plurality of gold bonding pads; a light emitting diode, including: a substantially transparent substrate, a semiconductor layer deposited on a bottom surface of the substrate, a plurality of gold bonding pads, coupled to the semiconductor layer, formed on the bottom surface of the substrate, and a plurality of gold micro posts, formed on the bonding pads, bonded to the gold bonding pads of the printed circuit board; an underfill layer, including a polymer and a filler, disposed between the bottom surface of the substrate and the top surface of the printed circuit board, to reduce water infiltration under the light emitting diode substrate; and a substantially transparent, hemispherical diffuser, mounted to a top surface of the substrate, to diffuse the light emitted through the top surface of the substrate. PRINTED CIRCUIT 20