公开(公告)号：US20170048965A1

公开(公告)日：2017-02-16

申请号：US14895944

申请日：2015-03-11

Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Maenghyo CHO ,  Kyu Jin CHO ,  Junghyun RYU ,  Je Sung KOH ,  Jong Gu LEE

IPC: H05K1/02 ,  G01B7/16

CPC classification number: H05K1/028 ,  G01B7/18 ,  G01B7/20 ,  G01N27/00 ,  G01N27/02 ,  G01R27/00 ,  G01R27/02 ,  G01R27/08 ,  H05K1/02 ,  H05K3/12 ,  H05K2201/07

Abstract: Disclosed herein is a deformation sensing flexible substrate using a pattern formed of a conductive material. The deformation sensing flexible substrate, using the pattern formed of the conductive material, includes a flexible substrate; and conductive patterns in which conductors including a conductive material are arranged and formed to be contactable and non-contact to each other based on deformation of the flexible substrate.

Abstract translation: 本文公开了使用由导电材料形成的图案的变形感测柔性基板。 使用由导电材料形成的图案的变形感测柔性基板包括柔性基板; 并且其中导体包括导电材料的导电图案基于柔性基板的变形被布置和形成为彼此接触和不接触。