公开(公告)号：US4712127B1

公开(公告)日：1997-05-06

申请号：US55615983

申请日：1983-11-29

Applicant: SGS THOMSON MICROELECTRONICS

Inventor： COLOMBO PIERO ,  CELLAI MARINO ,  MARTIIS DE COGNETTI CARLO

IPC: H01L23/48 ,  H01L23/28 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/12

CPC classification number: H01L23/4334 ,  H01L23/3121 ,  H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01014 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00

公开(公告)号：DE3343034C2

公开(公告)日：1997-11-20

申请号：DE3343034

申请日：1983-11-28

Applicant: SGS THOMSON MICROELECTRONICS

Inventor： COLOMBO PIERO ,  CELLAI MARINO ,  MARTIIS CARLO COGNETTI DE

IPC: H01L23/48 ,  H01L23/28 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/047 ,  H01L23/373

Abstract: A container for a semiconductor device has a metal plate and a body of synthetic resin which encapsulates a part of the plate, keeping a large surface thereof exposed. In the area separating the part encapsulated within the body of resin and the part without the resin, the plate has two opposed side notches and at least one groove connecting them.