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    LIGHT EMITTING ASSEMBLY AND METHOD FOR PREPARING THE SAME
    1.
    发明申请
    LIGHT EMITTING ASSEMBLY AND METHOD FOR PREPARING THE SAME 审中-公开
    发光组件及其制备方法

    公开(公告)号：WO2014094547A1

    公开(公告)日：2014-06-26

    申请号：PCT/CN2013/088692

    申请日：2013-12-05

    Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED ,  BYD COMPANY LIMITED

    Inventor： LIN, Xinping ,  REN, Yongpeng ,  XU, Qiang

    IPC: H01L33/64

    CPC classification number: H01L33/642 ,  H01L23/13 ,  H01L23/36 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A light emitting assembly and a method for preparing the light emitting assembly are provided. The light emitting assembly (100) includes: a copper heat sink (1); a ceramic substrate (2) having a mounting hole (6); a copper-oxygen eutectic layer (7) formed between the copper heat sink (1) and the ceramic substrate (2); a positive electrode (31) and a negative electrode (32) disposed on a surface of the ceramic substrate (2); an LED chip (4) disposed on the copper heat sink (1) and within the mounting hole (6), and electrically connected with the positive and negative electrodes (31, 32); and a fluorescent substance layer (5) covering the LED chip (4).

    Abstract translation: 提供一种发光组件及其制备方法。 发光组件（100）包括：铜散热器（1）; 具有安装孔（6）的陶瓷基板（2） 形成在铜散热器（1）和陶瓷基板（2）之间的铜 - 氧共晶层（7）; 设置在陶瓷基板（2）的表面上的正极（31）和负极（32）。 设置在所述铜散热器（1）上并在所述安装孔（6）内的LED芯片（4），并且与所述正极和所述负极（31,32）电连接; 和覆盖LED芯片（4）的荧光物质层（5）。

    METHOD FOR SELECTIVELY METALLIZING SURFACE OF CERAMIC SUBSTRATE, CERAMIC PRODUCT AND USE OF CERAMIC PRODUCT
    3.
    发明申请
    METHOD FOR SELECTIVELY METALLIZING SURFACE OF CERAMIC SUBSTRATE, CERAMIC PRODUCT AND USE OF CERAMIC PRODUCT 审中-公开
    陶瓷基材表面的选择性金属化方法，陶瓷产品和陶瓷产品的使用

    公开(公告)号：WO2012155811A1

    公开(公告)日：2012-11-22

    申请号：PCT/CN2012/075368

    申请日：2012-05-11

    Applicant: BYD COMPANY LIMITED ,  GONG, Qing ,  LIN, Xinping ,  REN, Yongpeng ,  ZHANG, Baoxiang

    Inventor： GONG, Qing ,  LIN, Xinping ,  REN, Yongpeng ,  ZHANG, Baoxiang

    IPC: C04B41/88 ,  C23C18/16

    CPC classification number: H05K3/181 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/88 ,  C04B2111/00844 ,  C23C18/06 ,  C23C18/1245 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1639 ,  H05K1/0306 ,  H05K3/182 ,  H05K3/185 ,  H05K2203/107 ,  Y10T428/24917 ,  C04B35/00 ,  C04B35/04 ,  C04B35/10 ,  C04B35/18 ,  C04B35/19 ,  C04B35/195 ,  C04B35/44 ,  C04B35/48 ,  C04B35/505 ,  C04B35/563 ,  C04B35/565 ,  C04B35/583 ,  C04B35/584 ,  C04B35/597 ,  C04B41/0036 ,  C04B41/4541 ,  C04B41/4572 ,  C04B41/0045 ,  C04B35/185 ,  C04B35/443 ,  C04B35/20

    Abstract: A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E is at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

    Abstract translation: 提供了选择性地金属化陶瓷基板的表面，陶瓷产品和陶瓷产品的用途的方法。 该方法包括以下步骤：A）模制和烧结陶瓷组合物以获得陶瓷基体，其中陶瓷组合物包含分散在陶瓷粉末中的陶瓷粉末和功能性粉末; 陶瓷粉末是选自E的氧化物，E的氮化物，E的氮氧化物和E的碳化物中的至少一种。 E是选自Li，Na，K，Rb，Cs，Be，Mg，Ca，Sr，Ba，B，Al，Ga，Si，Ge，P，As，Sc，Y，Zr中的至少一种 ，Hf和镧系元素; 功能性粉末是选自M的氧化物，M的氮化物，M的氧氮化物，M的碳化物和M的单质中的至少一种; 并且M是选自由Ti，V，Cr，Mn，Fe，Co，Ni，Cu，Zn，Nb，Mo，Tc，Ru，Rh，Pd，Ag，Cd，Ta， Re，Os，Ir，Pt，Au，In，Sn，Sb，Pb，Bi，Ce，Pr，Nd，Pm，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu; B）使用能量束照射陶瓷衬底的表面的预定区域，以在陶瓷衬底的表面的预定区域上形成化学电镀活性中心; 和C）在形成有化学电镀活性中心的陶瓷衬底上进行化学镀以在陶瓷衬底的表面的预定区域上形成金属层。

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