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    LED SUPPORT ASSEMBLY AND LED MODULE HAVING THE SAME
    1.
    发明申请
    LED SUPPORT ASSEMBLY AND LED MODULE HAVING THE SAME 审中-公开
    LED支持组件和具有该模块的LED模块

    公开(公告)号：WO2014206269A1

    公开(公告)日：2014-12-31

    申请号：PCT/CN2014/080581

    申请日：2014-06-24

    Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED ,  BYD COMPANY LIMITED

    Inventor： LIN, Xinping ,  XU, Qiang

    IPC: H01L33/48 ,  H01L33/56 ,  H01L33/54 ,  H01L33/64

    CPC classification number: H01L33/641 ,  H01L33/36 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/642 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

    Abstract: An LED support assembly and an LED module are provided. The LED support assembly includes: a metal heat sink(10), a first ceramic substrate(20)and a second ceramic substrate(30), the metal heat sink(10)defines an upper surface(11)；the first ceramic substrate(20)is adapted to support a LED chip(40)and disposed on the upper surface(11)of the metal heat sink；the second ceramic substrate(30)is adapted to support electrodes(51,52)of the LED chip(40)and surrounds the first ceramic substrate(20).

    Abstract translation: 提供LED支撑组件和LED模块。 所述LED支撑组件包括：金属散热器（10），第一陶瓷基板（20）和第二陶瓷基板（30），所述金属散热器（10）限定上表面（11）;所述第一陶瓷基板 20）适于支撑LED芯片（40）并且设置在金属散热器的上表面（11）上;第二陶瓷基板（30）适于支撑LED芯片（40）的电极（51,52） ）并且包围第一陶瓷基板（20）。

    LIGHT EMITTING ASSEMBLY AND METHOD FOR PREPARING THE SAME
    4.
    发明申请
    LIGHT EMITTING ASSEMBLY AND METHOD FOR PREPARING THE SAME 审中-公开
    发光组件及其制备方法

    公开(公告)号：WO2014094547A1

    公开(公告)日：2014-06-26

    申请号：PCT/CN2013/088692

    申请日：2013-12-05

    Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED ,  BYD COMPANY LIMITED

    Inventor： LIN, Xinping ,  REN, Yongpeng ,  XU, Qiang

    IPC: H01L33/64

    CPC classification number: H01L33/642 ,  H01L23/13 ,  H01L23/36 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A light emitting assembly and a method for preparing the light emitting assembly are provided. The light emitting assembly (100) includes: a copper heat sink (1); a ceramic substrate (2) having a mounting hole (6); a copper-oxygen eutectic layer (7) formed between the copper heat sink (1) and the ceramic substrate (2); a positive electrode (31) and a negative electrode (32) disposed on a surface of the ceramic substrate (2); an LED chip (4) disposed on the copper heat sink (1) and within the mounting hole (6), and electrically connected with the positive and negative electrodes (31, 32); and a fluorescent substance layer (5) covering the LED chip (4).

    Abstract translation: 提供一种发光组件及其制备方法。 发光组件（100）包括：铜散热器（1）; 具有安装孔（6）的陶瓷基板（2） 形成在铜散热器（1）和陶瓷基板（2）之间的铜 - 氧共晶层（7）; 设置在陶瓷基板（2）的表面上的正极（31）和负极（32）。 设置在所述铜散热器（1）上并在所述安装孔（6）内的LED芯片（4），并且与所述正极和所述负极（31,32）电连接; 和覆盖LED芯片（4）的荧光物质层（5）。

    METHOD FOR SOLDERING CHIP ON METALLIC-CERAMIC COMPOSITE BOARD AND METALLIC-CERAMIC COMPOSITE BOARD FOR SOLDERING CHIP THEREON
    5.
    发明申请
    METHOD FOR SOLDERING CHIP ON METALLIC-CERAMIC COMPOSITE BOARD AND METALLIC-CERAMIC COMPOSITE BOARD FOR SOLDERING CHIP THEREON 审中-公开
    在金属陶瓷复合板和金属陶瓷复合板上焊接芯片的方法，用于焊接芯片

    公开(公告)号：WO2017032334A1

    公开(公告)日：2017-03-02

    申请号：PCT/CN2016/096746

    申请日：2016-08-25

    Applicant: BYD COMPANY LIMITED

    Inventor： GONG, Qing ,  LIN, Xinping ,  XU, Qiang ,  ZHANG, Weifeng ,  SHAO, Changjian ,  WEN, Huaitong

    IPC: H01L23/00

    CPC classification number: H01L23/3735 ,  H01L21/4807 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/15159 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014

    Abstract: A method for soldering a chip on a metallic-ceramic composite board is provided, the metallic-ceramic composite board comprising a ceramic substrate, a first metal plate, and a second metal plate, plate faces at two sides of the ceramic substrate being configured to be a circuit face and a non-circuit face respectively, the first metal plate being connected to the circuit face, and the second metal plate being connected to the non-circuit face, wherein the method comprises: etching the second metal plate, such that the metallic-ceramic composite board forms a bent plate shape protruding towards the side at which the non-circuit face is located； and soldering the chip on the first metal plate, so as to obtain a substantially flat-straight metallic-ceramic composite board on which the chip is soldered. In addition, a metallic-ceramic composite board for soldering a chip thereon is provided.

    Abstract translation: 提供了一种在金属陶瓷复合板上焊接芯片的方法，所述金属陶瓷复合板包括陶瓷基板，第一金属板和第二金属板，所述陶瓷基板的两侧的板面构成为 分别是电路面和非电路面，第一金属板连接到电路面，第二金属板连接到非电路面，其中所述方法包括：蚀刻所述第二金属板，使得 金属陶瓷复合板形成朝向非电路面所在的一侧突出的弯曲板状; 并将芯片焊接在第一金属板上，以获得芯片焊接在其上的基本上平直的金属陶瓷复合板。 另外，提供了用于在其上焊接芯片的金属陶瓷复合板。

    CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE
    6.
    发明公开
    CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE 审中-公开

    公开(公告)号：EP4175425A1

    公开(公告)日：2023-05-03

    申请号：EP21831763.4

    申请日：2021-06-28

    Applicant: BYD Company Limited

    Inventor： ZHOU, Wei ,  XU, Qiang ,  XIE, Caicai

    IPC: H05K3/02 ,  C04B37/02

    Abstract: A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

    HEAT DISSIPATION ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE
    8.
    发明公开
    HEAT DISSIPATION ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE 审中-公开

    公开(公告)号：EP3660894A1

    公开(公告)日：2020-06-03

    申请号：EP18839408.4

    申请日：2018-06-29

    Applicant: BYD Company Limited

    Inventor： GONG, Qing ,  LIN, Xinping ,  XU, Qiang ,  LIU, Chengchen

    IPC: H01L23/367 ,  H01L23/373

    Abstract: The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.

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