METAL COMPOSITE AND METHOD OF PREPARING THE SAME, METAL-RESIN COMPOSITE AND METHOD OF PREPARING THE SAME
    2.
    发明申请
    METAL COMPOSITE AND METHOD OF PREPARING THE SAME, METAL-RESIN COMPOSITE AND METHOD OF PREPARING THE SAME 审中-公开
    金属复合材料及其制备方法,金属 - 树脂复合材料及其制备方法

    公开(公告)号:WO2013178057A1

    公开(公告)日:2013-12-05

    申请号:PCT/CN2013/076351

    申请日:2013-05-28

    Abstract: A metal composite, a method of preparing a metal composite, a metal-resin composite and a method of preparing the metal-resin composite are provided. The metal composite comprises: a metal substrate comprising a first layer formed on a surface of the metal substrate and an anodic oxidation layer formed on the first layer. The first layer comprises a first pore having an average diameter of about nanometers to about 1 millimeter, and the metal composite comprises aluminum alloy or aluminum. The anodic oxidation layer comprises a second layer contacted with the first layer of the metal substrate and a third layer formed on an outer surface of the second layer, and the second layer comprises a second pore having an average 10 diameter of about 10 nanometers to about 800 microns, and the third layer comprises a third pore having an average diameter of about 10 nanometers to about 800 microns.

    Abstract translation: 提供金属复合材料,金属复合材料的制备方法,金属 - 树脂复合材料和金属 - 树脂复合材料的制备方法。 金属复合体包括:金属基板,包括形成在金属基板的表面上的第一层和形成在第一层上的阳极氧化层。 第一层包括具有约纳米至约1毫米的平均直径的第一孔,并且金属复合材料包括铝合金或铝。 阳极氧化层包括与金属基底的第一层接触的第二层和形成在第二层的外表面上的第三层,并且第二层包括具有约10纳米至约10纳米的平均10直径的第二孔 800微米,第三层包括平均直径约10纳米至约800微米的第三孔。

    METAL-RESIN COMPOSITE AND PREPARATION METHOD THEREOF AND ELECTRONIC PRODUCT HOUSING
    5.
    发明公开
    METAL-RESIN COMPOSITE AND PREPARATION METHOD THEREOF AND ELECTRONIC PRODUCT HOUSING 审中-公开
    金属 - 树脂复合材料及其制备方法和电子产品外壳

    公开(公告)号:EP3243651A1

    公开(公告)日:2017-11-15

    申请号:EP15871779.3

    申请日:2015-10-29

    Abstract: The present disclosure provides a metal-resin composite and a method of preparing the same. The metal includes titanium or titanium alloy, the composite includes a metal substrate and a resin layer coated on at least part of surface of the metal substrate, a recess is distributed on the part of surface of the metal substrate coated with the resin layer, a part of resin of the resin layer extends downward to fill in the recess, a content of oxygen element on surface of the metal substrate is greater than 1wt%. The method includes dipping a metal substrate in an etching solution containing at least one alkali metal hydroxide so as to form a recess on surface of the metal substrate, and injecting a resin onto surface of the metal substrate after surface treatment sp as to form a resin layer. The metal-resin composite of the present disclosure is suitable for a shell of electronic product.

    Abstract translation: 本公开提供了一种金属 - 树脂复合材料及其制备方法。 所述金属包括钛或钛合金,所述复合物包括金属基材和涂布在所述金属基材的至少一部分表面上的树脂层,在涂布有所述树脂层的金属基材表面的一部分上分布有凹部, 树脂层的部分树脂向下延伸填充凹槽,金属基材表面的氧元素含量大于1wt%。 该方法包括将金属基材浸渍在含有至少一种碱金属氢氧化物的蚀刻溶液中,以在金属基材的表面上形成凹部,并且在表面处理后将金属基材的表面注入树脂以形成树脂 层。 本发明的金属 - 树脂复合材料适用于电子产品的外壳。

Patent Agency Ranking