Wire shape inspecting apparatus and wire shape inspecting method

    公开(公告)号:US11182921B2

    公开(公告)日:2021-11-23

    申请号:US16955785

    申请日:2018-12-20

    Applicant: SHINKAWA LTD.

    Inventor: Shigeru Amemiya

    Abstract: This wire shape inspecting apparatus comprises a camera which captures an image of a wire from above, a light which illuminates the wire from above, and a control unit, wherein the control unit performs: an inspection image acquiring process of acquiring a plurality of inspection images by causing the camera to capture images of the wire a plurality of times while changing a focal distance; and a first shape detecting process of identifying, in each inspection image, a light emitting portion, which is an image part including reflected light comprising light from the light that has been reflected by the wire, and identifying an actual light emitting portion position, which is the actual position of the light emitting portion, on the basis of the position of the light emitting portion in the inspection image and the focal distance when the inspection image was acquired.

Patent Agency Ranking