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    VOLTAGE SWITCHABLE DIELECTRIC MATERIAL FORMATIONS AND SUPPORTING IMPEDANCE ELEMENTS FOR ESD PROTECTION
    1.
    发明申请
    VOLTAGE SWITCHABLE DIELECTRIC MATERIAL FORMATIONS AND SUPPORTING IMPEDANCE ELEMENTS FOR ESD PROTECTION 审中-公开
    电压可切换电介质材料和支持的ESD保护元件

    公开(公告)号：WO2013070806A1

    公开(公告)日：2013-05-16

    申请号：PCT/US2012/063999

    申请日：2012-11-07

    Applicant: SHOCKING TECHNOLOGIES, INC.

    Inventor： VRTIS, Joan ,  VASQUEZ, Daniel ,  FLEMING, Robert ,  KOSOWSKY, Lex

    IPC: H01L27/04 ,  H01L23/60

    CPC classification number: H01L23/60 ,  H01L27/0288 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Embodiments disclosed herein generally relate to voltage switchable dielectric (VSD) materials and supporting impedance elements, and to structures, methods and devices employing voltage switchable dielectric materials and supporting impedance elements to achieve protection against ESD events, wherein the VSD materials and/or supporting impedance elements are incorporated in first level and/or second level packages, and wherein the first level package may be a die attached to a substrate and the second level package may be a circuit board to which the first level package is attached.

    Abstract translation: 本文公开的实施例通常涉及可变压电介质（VSD）材料和支撑阻抗元件，以及使用可切换电介质材料和支持阻抗元件以实现ESD事件保护的结构，方法和器件，其中VSD材料和/或支持阻抗 元件被并入第一级和/或第二级封装中，并且其中第一级封装可以是附接到衬底的管芯，并且第二级封装可以是与第一级封装件相连的电路板。

    METAL DEPOSITION
    3.
    发明申请
    METAL DEPOSITION 审中-公开
    金属沉积

    公开(公告)号：WO2011059769A1

    公开(公告)日：2011-05-19

    申请号：PCT/US2010/054563

    申请日：2010-10-28

    Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex

    Inventor： KOSOWSKY, Lex

    IPC: C25D5/48

    CPC classification number: C25D5/022 ,  C25D5/54 ,  H05K1/0254 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/107 ,  H05K3/188 ,  H05K3/388 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105

    Abstract: Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

    Abstract translation: 系统和方法包括在可开关电介质材料上沉积一种或多种材料。 在某些方面，电压可切换介电材料设置在导电背板上。 在一些实施例中，电压可切换介电材料包括具有与其上沉积相关联的不同特征电压的区域。 一些实施例包括掩蔽，并且可以包括使用可移除的接触掩模。 某些实施例包括电驱动。 一些实施例包括设置在两层之间的中间层。

    SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION
    4.
    发明申请
    SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION 审中-公开
    在垂直切换配置中使用电压可切换介质材料的嵌入层的衬底器件或封装

    公开(公告)号：WO2009129188A1

    公开(公告)日：2009-10-22

    申请号：PCT/US2009/040384

    申请日：2009-04-13

    Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex ,  FLEMING, Robert ,  GRAYDON, Bhret

    Inventor： KOSOWSKY, Lex ,  FLEMING, Robert ,  GRAYDON, Bhret

    IPC: H05K1/02

    CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0738 ,  H05K2203/105

    Abstract: A substrate device includes an embedded layer of VSD material (230) that overlays a conductive element or layer (240) to provide a ground. An electrode (210), connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

    Abstract translation: 衬底器件包括覆盖导电元件或层（240）以提供接地的VSD材料（230）的嵌入层。 连接到要被保护的电路元件的电极（210）延伸到基板的厚度以与VSD层接触。 当电路元件在正常电压下工作时，VSD层是电介质的，不连接到地。 当在电路元件上发生瞬态电事件时，VSD层立即切换到导通状态，使得第一电极连接到地。

    SYSTEM AND METHOD FOR INCLUDING PROTECTIVE VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN THE DESIGN OR SIMULATION OF SUBSTRATE DEVICES
    10.
    发明申请
    SYSTEM AND METHOD FOR INCLUDING PROTECTIVE VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN THE DESIGN OR SIMULATION OF SUBSTRATE DEVICES 审中-公开
    在基板设备的设计或仿真中包括保护电压可切换介质材料的系统和方法

    公开(公告)号：WO2008153584A1

    公开(公告)日：2008-12-18

    申请号：PCT/US2007/079377

    申请日：2007-09-25

    Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex ,  FLEMING, Robert

    Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

    IPC: G06F17/50

    CPC classification number: G06F17/5068 ,  H05K1/0254 ,  H05K1/0259 ,  H05K1/0293 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/0738 ,  H05K2203/105

    Abstract: A substrate device is designed by identifying one or more criteria for handling of a transient electrical event on the substrate device. The one or more criteria may be based at least in part on an input provided from a designer. From the one or more criteria, one or more characteristics may be determined for integrating VSD material as a layer within or on at least a portion of the substrate device. The layer of VSD material may be positioned to protect one or more components of the substrate from the transient electrical condition.

    Abstract translation: 通过识别用于处理衬底装置上的瞬态电事件的一个或多个标准来设计衬底装置。 该一个或多个标准可以至少部分地基于从设计者提供的输入。 根据一个或多个标准，可以确定一个或多个特性，用于将VSD材料整合为基底装置的至少一部分内或之上的层。 VSD材料层可以被定位以保护衬底的一个或多个部件免受瞬态电气条件的影响。

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