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公开(公告)号：DE2531163A1
公开(公告)日：1977-02-03
申请号：DE2531163
申请日：1975-07-11
Applicant: SIEMENS AG
Inventor： ANDRASCEK ERNST ING GRAD , HADERSBECK HANS ING GRAD
Abstract: 1484542 Cleaning and activating circuit boards for soldering SIEMENS A G 4 May 1976 [11 July 1975] 18120/76 Heading C7U [Also in Division B3] The solderability of electric circuit boards with Cu or Cu alloy conductor paths is improved by cleaning the boards in an aqueous solution containing a non ionic surfactant and an organic acid and then activating in an aqueous solution containing potassium peroxy disulphate (persulphate) and an acid. The preferred cleaning solution contains 20-100g/l of an hydroxyethylated alkyl phenol and 15-80g/l of an organic acid such as formic acid. The activating solution is preferably saturated with the potassium peroxydisulphate the pH adjusted to 2-4 with H 2 SO 4 and stabilized with phosphoric acid. The boards may be rinsed with water between treatments and also retreated in the cleaning solution after treating in the activating solution. Colophony or soldering lacquers may then be applied and dried.
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公开(公告)号：DE2641540A1
公开(公告)日：1978-03-16
申请号：DE2641540
申请日：1976-09-15
Applicant: SIEMENS AG
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公开(公告)号：DE2524581A1
公开(公告)日：1976-12-23
申请号：DE2524581
申请日：1975-06-03
Applicant: SIEMENS AG
Abstract: A flexible printed circuit board has conductors on opposite sides thereof which are through-contacted by die-punching the board to form an angularly-displaced tongue portion about which solder is flowed to contact both conductors. A terminal pin is optionally inserted through the board to connect a component, the pin being engaged by the angularly-displaced tongue to ensure reliable mechanical and electrical contact in the soldered joint. The through-contact is formed with a bevel-faced die in conjunction with a cutting plate.
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