公开(公告)号：DE3566980D1

公开(公告)日：1989-02-02

申请号：DE3566980

申请日：1985-10-22

Applicant: SIEMENS AG

Inventor： QUELLA FERDINAND DR ,  HADERSBECK HANS ING GRAD ,  GOEPEL ERNST DIPL ING

IPC: B41J2/16 ,  B41J3/04

公开(公告)号：DE3002732A1

公开(公告)日：1981-08-13

申请号：DE3002732

申请日：1980-01-25

Applicant: SIEMENS AG

Inventor： HADERSBECK HANS ING GRAD ,  ZUKIER HUBERT

IPC: B05C3/12 ,  G03F7/30 ,  B05C3/02 ,  G03D3/08

Abstract: The immersion bath is for double-sided surface treatment of a material web using a fluid. A trough-shaped working chamber (11) with ventilation (6), has two slots (3,4) for inlet and outlet of the band. The cross-section of the chamber narrows towards the slots, causing damming-up of the fluid, through which the band is drawn centrally. The central section of the chamber is formed as a tower (5) and it has an upper and lower inlet (1,2) for fluid feed at small high pressure. Fluid catch grooves (7,8) are positioned below the band inlet and outlet. The top of the chamber has removable covers (9,10).

公开(公告)号：DE3047588A1

公开(公告)日：1982-07-22

申请号：DE3047588

申请日：1980-12-17

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ,  HADERSBECK HANS ING GRAD

IPC: C09K13/00 ,  C23F1/36 ,  C23F1/38 ,  H01L21/70 ,  C23F1/00

Abstract: The etchant consists of an aq. soin. contg. Na 2CO3; potassium ferricyanide; potassium peroxydisulphate; tri-potassium citrate; and aluminium hydroxyacetate or sodium acetate. The pref. soln. uses 1 litre of water in which are dissolved 0.5-1120 g Na 2CO3;0.5-420 g potassium ferricyanide; 0.5-50 g potassium peroxydisulphate; 0.5-45 g tri-potassium citrate; and 0.01-2 g aluminium hydroxyacetate of sodium acetate. The etchant is pref. used to create thin film structures, the etching temp. being varied to increase the selectivity of the etchant. Used for mfr. of resistance- or RC- networks; liq. crystal displays; thin film microcircuits etc.

公开(公告)号：DE2951466A1

公开(公告)日：1981-07-23

申请号：DE2951466

申请日：1979-12-20

Applicant: SIEMENS AG

Inventor： HADERSBECK HANS ING GRAD

IPC: H05K1/00 ,  H05K1/16 ,  H05K3/00 ,  H05K3/36 ,  H05K3/40

Abstract: The printed circuit consists of a laminate with conducting metal layers on both sides. The laminate (2) has three layers and is held between two reinforcing plates (1,3). The laminate not only has wiring but also capacitors and inductors. Resistors (9) are located on one of the reinforcing plates. The plate with the resistors has holes (8) for making through-contacts. These holes are conical in the direction of the laminate and are provided with a solderable metal lining. A seal is provided on those sides of the plates facing the laminate. The two plates are connected rigidly together, pref. by ultrasonic welding at specified places.

公开(公告)号：DE3139341A1

公开(公告)日：1983-04-21

申请号：DE3139341

申请日：1981-10-02

Applicant: SIEMENS AG

Inventor： HADERSBECK HANS ING GRAD ,  ZUKIER HUBERT

IPC: G03G7/00 ,  G03G8/00

Abstract: In connection with X-ray electrography, toner images must be transferred onto a transparent base by means of an extremely fine-grained powder and with very flat gradation, and durably embedded therein. This is carried out by means of a transfer film comprising a commercially available polyethylene terephthalate film onto which a gelatin coating has been applied with high adherence. Just before the toner image is transferred, the gelatin coating is temporarily softened, and the transfer coating prepared in this way is pressed onto the toner image using moderate pressure.

公开(公告)号：DE2840972A1

公开(公告)日：1980-03-27

申请号：DE2840972

申请日：1978-09-20

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ,  HADERSBECK HANS ING GRAD ,  HACKE HANS-JUERGEN DIPL ING ,  FREITAG THEODOR DIPL PHYS

IPC: H01L23/08 ,  H01L21/56 ,  H01L23/24 ,  H01L23/31 ,  H01L23/42 ,  H01L23/28 ,  H01L23/48 ,  H01B17/66

Abstract: A simple and low-cost plastic encapsulation for semiconductor elements consisting of two plastic mouldings (7, 8) which are produced by pressing or injection and which are pressed together in a pressing device after being positioned accurately above and below the system carrier (5) holding the chip (6).

公开(公告)号：DE2641937A1

公开(公告)日：1978-03-23

申请号：DE2641937

申请日：1976-09-17

Applicant: SIEMENS AG

Inventor： HADERSBECK HANS ING GRAD ,  ZUKIER HUBERT

IPC: H01B13/10 ,  H01B19/04 ,  H05K1/00 ,  H05K3/02 ,  H05K3/38 ,  H01B3/54 ,  H01B5/14

Abstract: The flexible insulating strip is coated with metal in a process, in which a thin metal strip is laminated onto the insulating strip, using an intermediate adhesive film and pressure and heat. The insulating strip (1) and the metal strip (5) are aligned and drawn over a limited circumference range of a heated laminating roller. Preferably the insulating strip is drawn over a larger circumference range of the roller than the metal strip. The two strips may be drawn together over the roller range, corresponding to a centre angle of 40 to 50 deg. The side of the insulating strip, opposite to the adhesive film (2) is drawn directly over the laminating roller surface.

公开(公告)号：DE2531163A1

公开(公告)日：1977-02-03

申请号：DE2531163

申请日：1975-07-11

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ING GRAD ,  HADERSBECK HANS ING GRAD

IPC: H01H11/04 ,  B23K1/20 ,  B23K35/36 ,  C23G1/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/38 ,  C23G5/00

Abstract: 1484542 Cleaning and activating circuit boards for soldering SIEMENS A G 4 May 1976 [11 July 1975] 18120/76 Heading C7U [Also in Division B3] The solderability of electric circuit boards with Cu or Cu alloy conductor paths is improved by cleaning the boards in an aqueous solution containing a non ionic surfactant and an organic acid and then activating in an aqueous solution containing potassium peroxy disulphate (persulphate) and an acid. The preferred cleaning solution contains 20-100g/l of an hydroxyethylated alkyl phenol and 15-80g/l of an organic acid such as formic acid. The activating solution is preferably saturated with the potassium peroxydisulphate the pH adjusted to 2-4 with H 2 SO 4 and stabilized with phosphoric acid. The boards may be rinsed with water between treatments and also retreated in the cleaning solution after treating in the activating solution. Colophony or soldering lacquers may then be applied and dried.

公开(公告)号：DE3870685D1

公开(公告)日：1992-06-11

申请号：DE3870685

申请日：1988-02-02

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ING ,  HADERSBECK HANS ING GRAD

IPC: C25D17/00 ,  C25D7/12 ,  C25D17/08 ,  C25D17/12 ,  C25D21/06 ,  C25D21/18 ,  H01L21/288 ,  H01L21/60

Abstract: Electroplating appts. to produce fine-structured thick metal deposits, e.g. a flat-topped humps of quadratic shape, 140 x 140 mu or less and max. 18 mu high +/- 1 mu on a chip module, uses an electroplating bath containing a flattener in which the electroplating cell is immersed. The latter consists of an anode, a cathode, an aperture ring and a holder for a semiconductor wafer. The external circuit contains an activated ring and a holder for a semiconductor wafer. The external circuit contains an activated carbon filter.

公开(公告)号：AT55845T

公开(公告)日：1990-09-15

申请号：AT85110604

申请日：1985-08-23

Applicant: SIEMENS AG

Inventor： ANDRASCEK ERNST ,  HADERSBECK HANS ING GRAD

IPC: H01L21/60 ,  H01L23/48 ,  H01L23/485