公开(公告)号：ZA8804726B

公开(公告)日：1989-03-29

申请号：ZA8804726

申请日：1988-07-01

Applicant: SIEMENS AG

Inventor： WINTER GERHARD ,  GERHARD WINTER ,  DREKMEIER KARL-GERD ,  KARL-GERD DREKMEIER

IPC: H01L23/14 ,  H05K1/02 ,  H05K1/05 ,  H01L ,  H05K

CPC classification number: H05K1/0203 ,  H01L23/142 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/053 ,  H05K2201/09745 ,  H05K2201/10181 ,  H05K2201/10386 ,  H05K2201/10553 ,  H01L2924/00

公开(公告)号：ZA884726B

公开(公告)日：1989-03-29

申请号：ZA884726

申请日：1988-07-01

Applicant: SIEMENS AG

Inventor： WINTER GERHARD ,  GERHARD WINTER ,  DREKMEIER KARL-GERD ,  KARL-GERD DREKMEIER

IPC: H01L23/14 ,  H05K1/02 ,  H05K1/05 ,  H01L ,  H05K

Abstract: A metal plate is connected over a large area to one side of a glass or ceramic substrate for good heat distribution and removal. The metal plate consists of three layers, namely two outer copper layers and a center Invar layer having the thickness ratio of the layers of approximately 20:60:20. As a result of such a selected thickness ratio, the metal plate exhibits approximately the same coefficient of thermal expansion as the substrate and an inadmissible bending of the substrate or overstressing of the solder or adhesive line between the substrate and metal plate is prevented.