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公开(公告)号:SE398053B
公开(公告)日:1977-12-05
申请号:SE7307593
申请日:1973-05-29
Applicant: SIEMENS AG
Inventor: KRUGER E
Abstract: An electrical conductor of relatively small cross section is provided with a loop at one end adapted to be dipped into a bath of molten solder, whereby a predetermined amount of solder adheres to the loop as a membrane, formed by capillary action. The conductor is thus provided with a known quantity of solder, so that the conductor may be soldered to a conductive element by application of a known quantity of heat, without requiring any additional solder to be supplied at the time of soldering. The solder membranes are formed continuously by an automatic process, and the conductors are soldered into fixed relation with conductive elements automatically by the application of heat and pressure from a soldering element.
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公开(公告)号:ZA7303315B
公开(公告)日:1974-04-24
申请号:ZA7303315
申请日:1973-05-16
Applicant: SIEMENS AG
Inventor: KRUGER E
CPC classification number: B23K1/085 , B23K1/08 , H01R43/16 , H05K3/3426 , H05K2201/10946 , H05K2201/10984 , Y02P70/613 , Y10T29/49169 , Y10T29/49982
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公开(公告)号:BR7304144D0
公开(公告)日:1974-08-15
申请号:BR414473
申请日:1973-06-01
Applicant: SIEMENS AG
Inventor: KRUGER E
Abstract: An electrical conductor of relatively small cross section is provided with a loop at one end adapted to be dipped into a bath of molten solder, whereby a predetermined amount of solder adheres to the loop as a membrane, formed by capillary action. The conductor is thus provided with a known quantity of solder, so that the conductor may be soldered to a conductive element by application of a known quantity of heat, without requiring any additional solder to be supplied at the time of soldering. The solder membranes are formed continuously by an automatic process, and the conductors are soldered into fixed relation with conductive elements automatically by the application of heat and pressure from a soldering element.
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公开(公告)号:ZA733315B
公开(公告)日:1974-04-24
申请号:ZA733315
申请日:1973-05-16
Applicant: SIEMENS AG
Inventor: KRUGER E
Abstract: An electrical conductor of relatively small cross section is provided with a loop at one end adapted to be dipped into a bath of molten solder, whereby a predetermined amount of solder adheres to the loop as a membrane, formed by capillary action. The conductor is thus provided with a known quantity of solder, so that the conductor may be soldered to a conductive element by application of a known quantity of heat, without requiring any additional solder to be supplied at the time of soldering. The solder membranes are formed continuously by an automatic process, and the conductors are soldered into fixed relation with conductive elements automatically by the application of heat and pressure from a soldering element.
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