公开(公告)号：SE0802663A1

公开(公告)日：2010-06-24

申请号：SE0802663

申请日：2008-12-23

Applicant: SILEX MICROSYSTEMS AB

Inventor： EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  SVEDIN NIKLAS ,  AAGREN PETER

IPC: H01L23/522 ,  B81B7/00 ,  B81C1/00 ,  G02B26/08 ,  H01L21/768

公开(公告)号：EP2377154A4

公开(公告)日：2012-06-27

申请号：EP09835356

申请日：2009-12-23

Applicant: SILEX MICROSYSTEMS AB

Inventor： EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  AAGREN PETER ,  SVEDIN NIKLAS

IPC: G02B26/08 ,  B81B7/00 ,  B81C1/00 ,  H01L21/768

CPC classification number: G02B26/0833 ,  B81B7/0006 ,  B81B7/007 ,  B81B2207/092 ,  B81B2207/095 ,  G02B6/3518 ,  G02B6/3584 ,  G02B26/0841 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention relates to a layered micro-electronic and/or micro-mechanic structure, comprising at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro-mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided.

公开(公告)号：SE1250672A1

公开(公告)日：2013-12-22

申请号：SE1250672

申请日：2012-06-21

Applicant: SILEX MICROSYSTEMS AB

Inventor： AAGREN PETER

IPC: B81B7/02 ,  B81B5/00 ,  G02B26/08 ,  H01L21/30 ,  H01L21/768 ,  H01L23/522

公开(公告)号：SE533992C2

公开(公告)日：2011-03-22

申请号：SE0802663

申请日：2008-12-23

Applicant: SILEX MICROSYSTEMS AB

Inventor： EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  SVEDIN NIKLAS ,  AAGREN PETER

IPC: H01L23/522 ,  B81B7/00 ,  B81C1/00 ,  G02B26/08 ,  H01L21/768

公开(公告)号：SE1051193A1

公开(公告)日：2010-11-12

申请号：SE1051193

申请日：2008-12-23

Applicant: SILEX MICROSYSTEMS AB

Inventor： EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  AAGREN PETER ,  SVEDIN NIKLAS ,  ERICSSON THOMAS

IPC: G02B26/08 ,  B81B7/00 ,  H01L23/522