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    E-FILM CARTRIDGE WITH SENSOR AVOIDANCE FEATURE
    1.
    发明申请
    E-FILM CARTRIDGE WITH SENSOR AVOIDANCE FEATURE 审中-公开
    具有传感器避让功能的E-FILM碳粉盒

    公开(公告)号：WO0106765A8

    公开(公告)日：2001-10-25

    申请号：PCT/US0040384

    申请日：2000-07-14

    Applicant: SILICON FILM TECHNOLOGIES INC

    Inventor： SAPIR ITZHAK

    IPC: H01L21/822 ,  H01L27/04 ,  H04N5/225

    CPC classification number: H04N1/2116 ,  G03B17/26 ,  G03B17/28 ,  H01L21/822 ,  H01L27/04 ,  H04N5/225 ,  H04N5/2251

    Abstract: An electronic film cartridge includes a can section that defines an outer contour and is used to hold electronic components, and an imager assembly. The outer contour is configured so as to not completely depress at least one sensor mounted to the film compartment of a photographic camera into which the film cartridge is to be inserted. The electronic film cartridge is also configured to fit within different cameras with different dimensions between the film can area and the aperture.

    Abstract translation: 电子暗盒包括限定外部轮廓并用于容纳电子部件的罐部分和成像器组件。 外轮廓构造成不完全压下安装到胶卷暗盒要插入的照相机的胶卷盒中的至少一个传感器。 电子暗盒也被配置为适合胶卷罐区域和光圈之间具有不同尺寸的不同相机。

    High-density packaging of integrated circuits
    5.
    发明专利
    High-density packaging of integrated circuits 未知

    公开(公告)号：AU6349000A

    公开(公告)日：2001-02-05

    申请号：AU6349000

    申请日：2000-07-14

    Applicant: SILICON FILM TECHNOLOGIES INC

    Inventor： SAPIR ITZHAK

    IPC: H01L21/822 ,  H01L27/04 ,  H04N5/225

    Abstract: An integrated circuit constructed on a folded integrated circuit is described. The folded integrated circuit has a much smaller form-factor than the original (unfolded) circuit and is thus more suitable for use in miniature devices, such as, for example, electronic camera, electronic-film cartridge, cellular telephone, handheld computer, handheld digital music device, portable devices, handheld devices, and the like. In one embodiment, the integrated circuit is folded by thinning an area of the substrate such that the thinned area of the substrate becomes flexible. Conducting traces on the upper surface of the substrate connect an active region on one side of the thinned area to an active region on the other side of the thinned area. The substrate is folded at the thinned area to thereby reduce the size of the substrate. In one embodiment, a heat-sink is inserted between the folds to carry heat away from the substrate.

    Image sensor package with image plane reference
    7.
    发明专利
    Image sensor package with image plane reference 未知

    公开(公告)号：AU5181300A

    公开(公告)日：2000-12-28

    申请号：AU5181300

    申请日：2000-06-02

    Applicant: SILICON FILM TECHNOLOGIES INC

    Inventor： STERN JONATHAN MICHAEL ,  SAPIR ITZHAK ,  HORNBACK WILLIAM B

    IPC: H04N5/225 ,  H01L31/0203

    Abstract: An integrated circuit package that provides a reference plane relative to an image plane of an image sensor is described. The reference plane is aligned with respect to the image plane of the sensor such that the sensor can be mounted in an optical assembly quickly, easily, accurately, and inexpensively. The package can be thin, allowing for use of the package in retrofit applications such as using the packaged image sensor in a conventional 35 mm camera. The package includes a standoff frame for mounting a transparent window. The package includes reference members, such as rails, that define the reference plane. The package provides a desired tolerance between the reference plane and image plane of the sensor when the sensor is bonded into the package. The window can be flat or configured as a lens to focus the image on the image plane. The window can be configured such that its front (outer) face becomes the image plane of the packaged image sensor.

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