中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

6 records (took 0.023 seconds)

    FLIP-CHIP PACKAGE WITH IMAGE PLANE REFERENCE
    1.
    发明申请
    FLIP-CHIP PACKAGE WITH IMAGE PLANE REFERENCE 审中-公开
    翻转芯片封装与图像平面参考

    公开(公告)号：WO0111694A3

    公开(公告)日：2001-08-30

    申请号：PCT/US0021345

    申请日：2000-08-04

    Applicant: SILICON FILM TECHNOLOGIES INC

    Inventor： STERN JONATHAN MICHAEL

    IPC: H01L31/0203

    CPC classification number: H01L31/0203

    Abstract: An integrated circuit package that provides a reference plane relative to an image plane of an image sensor is described. The reference plane is aligned with respect to the image plane of the sensor such that the sensor can be mounted in an optical assembly quickly, easily, accurately, and inexpensively. The package can be thin, allowing for use of the package in retrofit applications such as using the packaged image sensor in a conventional 35 mm camera. The package includes a transparent window. The window includes reference members, such as rails, that define the reference plane. The package provides a desired tolerance between the reference plane and image plane of the sensor when the sensor is bonded into the package. The window can be flat or configured as a lens to focus the image on the image plane.

    Abstract translation: 描述了提供相对于图像传感器的图像平面的参考平面的集成电路封装。 参考平面相对于传感器的图像平面对齐，使得传感器可以快速，容易，准确且便宜地安装在光学组件中。 该封装可以很薄，允许在改装应用中使用该封装，例如在传统的35mm相机中使用封装的图像传感器。 该软件包包含一个透明窗口。 该窗口包括定义参考平面的参考构件，如导轨。 当传感器粘合到封装中时，封装提供了传感器参考平面和图像平面之间的所需公差。 该窗口可以是平面的或配置为透镜以将图像聚焦在图像平面上。

    Image sensor package with image plane reference
    5.
    发明专利
    Image sensor package with image plane reference 未知

    公开(公告)号：AU5181300A

    公开(公告)日：2000-12-28

    申请号：AU5181300

    申请日：2000-06-02

    Applicant: SILICON FILM TECHNOLOGIES INC

    Inventor： STERN JONATHAN MICHAEL ,  SAPIR ITZHAK ,  HORNBACK WILLIAM B

    IPC: H04N5/225 ,  H01L31/0203

    Abstract: An integrated circuit package that provides a reference plane relative to an image plane of an image sensor is described. The reference plane is aligned with respect to the image plane of the sensor such that the sensor can be mounted in an optical assembly quickly, easily, accurately, and inexpensively. The package can be thin, allowing for use of the package in retrofit applications such as using the packaged image sensor in a conventional 35 mm camera. The package includes a standoff frame for mounting a transparent window. The package includes reference members, such as rails, that define the reference plane. The package provides a desired tolerance between the reference plane and image plane of the sensor when the sensor is bonded into the package. The window can be flat or configured as a lens to focus the image on the image plane. The window can be configured such that its front (outer) face becomes the image plane of the packaged image sensor.

    System and method for operating an electronic film camera
    6.
    发明专利
    System and method for operating an electronic film camera 未知

    公开(公告)号：AU1719100A

    公开(公告)日：2000-06-05

    申请号：AU1719100

    申请日：1999-11-12

    Applicant: SILICON FILM TECHNOLOGIES INC

    Inventor： STERN JONATHAN MICHAEL ,  MIFFLIN ROBERT ,  CARLSON RANDY

    IPC: H04N1/00 ,  H04N1/21 ,  H04N5/225 ,  H04N5/232 ,  G03B17/48 ,  H04N7/18

    Abstract: An electronic film (E-film) apparatus that reversibly converts a conventional film camera body into an E-film camera is described. The electronic film apparatus includes one or more state sensors that sense the operating state of the camera body. State sensors include an electromagnetic sensor, an acoustic sensor, and/or an optical sensor. The data gathered by the sensors is used to determine the operating state of the camera. Based on the operating state of the camera, the E-film apparatus operates in various power modes, including sleep modes, low power modes, and full power modes. The electromagnetic sensor includes a loop or coil that converts electromagnetic fields into an electrical signal. The acoustic sensor senses vibrations in the camera due to operation of the mechanical aspects of the camera body. The acoustic sensor converts vibrations in the camera body into an electrical signal. If the envelope of the electrical signals from the sensors exceeds a threshold, the E-film apparatus awakens from a lower power mode. Signal processing is then used to compare a measured waveform or spectrum to an expected waveform or spectrum. The E-film apparatus can also sense opening of the camera shutter by illuminating the shutter with a low duty cycle infrared light source and measuring the light reflected by the shutter.

Patent Agency Ranking