公开(公告)号：WO2014160556A3

公开(公告)日：2014-11-27

申请号：PCT/US2014031003

申请日：2014-03-18

Applicant: SILICON GRAPHICS INT CORP

Inventor： DEAN STEVEN J ,  COLLINS DAVID R ,  KINYON PAUL

IPC: H04L29/08

CPC classification number: G06F12/0246 ,  G06F1/263 ,  G06F3/0635 ,  G06F11/2002 ,  G06F11/2007 ,  G06F11/201 ,  G06F11/2084 ,  G06F11/2089

Abstract: A high performance computing (HPC) system includes computing blades having a first region that includes processors for performing a computation, and a second region that includes non-volatile memory for use in performing the computation and another computing processor for performing data movement and storage. Because data movement and storage are offloaded to the secondary processor, the processors for performing the computation are not interrupted to perform these tasks. A method for use in the HPC system receives instructions in the computing processors and first data in the memory. The method includes receiving second data into the memory while continuing to execute the instructions in the computing processors, without interruption. A computer program product implementing the method is also disclosed.

Abstract translation: 高性能计算（HPC）系统包括计算刀片，其具有包括用于执行计算的处理器的第一区域和包括用于执行计算的非易失性存储器的第二区域以及用于执行数据移动和存储的另一计算处理器。 由于数据移动和存储被卸载到辅助处理器，执行计算的处理器不会中断以执行这些任务。 用于HPC系统的方法接收计算处理器中的指令和存储器中的第一数据。 该方法包括将第二数据接收到存储器中，同时继续在计算处理器中执行指令而不中断。 还公开了实施该方法的计算机程序产品。

公开(公告)号：EP2918151A4

公开(公告)日：2016-10-19

申请号：EP13853840

申请日：2013-09-24

Applicant: SILICON GRAPHICS INT CORP

Inventor： DEAN STEVEN J ,  RAMSEIER ROGER ,  MALONEY MARK ,  COLLINS DAVID R

IPC: H05K7/20 ,  G06F1/18 ,  G06F1/20

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.

公开(公告)号：EP2918149A4

公开(公告)日：2016-07-13

申请号：EP13852972

申请日：2013-09-24

Applicant: SILICON GRAPHICS INT CORP

Inventor： DEAN STEVEN J ,  COLLINS DAVID R ,  MCCANN TIMOTHY SCOTT ,  FRANZ PERRY D ,  GLANZMAN JEFFREY M

IPC: H05K7/20 ,  G06F1/18 ,  G06F1/20 ,  H05K5/00

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.