公开(公告)号：EP2918151A4

公开(公告)日：2016-10-19

申请号：EP13853840

申请日：2013-09-24

Applicant: SILICON GRAPHICS INT CORP

Inventor： DEAN STEVEN J ,  RAMSEIER ROGER ,  MALONEY MARK ,  COLLINS DAVID R

IPC: H05K7/20 ,  G06F1/18 ,  G06F1/20

CPC classification number: G06F1/20 ,  G06F1/181 ,  G06F2200/201 ,  H05K7/20754 ,  H05K7/20827

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.