公开(公告)号：US20160373629A1

公开(公告)日：2016-12-22

申请号：US15101286

申请日：2014-11-27

Applicant: SILICONFILE TECHNOLOGIES INC.

Inventor： Huy Chan JUNG ,  Heui-Gyun AHN ,  Sang Wook AHN ,  Yong Woon LEE

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H04N5/2257 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/16145 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2258

Abstract: The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.

Abstract translation: 本发明提供了一种图像处理包，包括：图像传感器，用于以光的形式从外部接收被摄体的图像，并将被摄体的图像转换为图像信号; 以及图像信号处理器，用于处理从图像传感器输出并再现被摄体的图像的图像信号，其中图像处理包具有图像传感器垂直堆叠在图像信号处理器上的结构。

公开(公告)号：US20160301888A1

公开(公告)日：2016-10-13

申请号：US15100501

申请日：2014-11-11

Applicant: SILICONFILE TECHNOLOGIES INC.

Inventor： Sang Wook AHN ,  Yong Woon LEE ,  Huy Chan JUNG ,  Heui-Gyun AHN

IPC: H04N5/378 ,  H04N5/357 ,  H04N5/3745 ,  H04N5/376 ,  H04N5/353

CPC classification number: H04N5/378 ,  H04N5/341 ,  H04N5/3532 ,  H04N5/357 ,  H04N5/3745 ,  H04N5/37452 ,  H04N5/37455 ,  H04N5/3765

Abstract: The present invention relates to a technology with enables an image signal processor to output image data at a faster speed while using a memory having a smaller capacity. The image signal processor includes a pair of line memories for storing image data output from an analog-digital converter such that the image data alternates in units of horizontal lines, and outputting the stored image data in units of blocks according to a first-in-first-out method.

Abstract translation: 本发明涉及一种能够使图像信号处理器以更快的速度输出图像数据的技术，同时使用具有较小容量的存储器。 图像信号处理器包括一对行存储器，用于存储从模拟数字转换器输出的图像数据，使得图像数据以水平行为单位交替，并且以块为单位输出存储的图像数据， 先出方法。

公开(公告)号：US20130189828A1

公开(公告)日：2013-07-25

申请号：US13775178

申请日：2013-02-23

Applicant: SILICONFILE TECHNOLOGIES INC.

Inventor： Heui-Gyun AHN ,  Se-Jung OH ,  In-Gyun JEON ,  Jun-Ho WON

IPC: H01L23/00

CPC classification number: H01L24/03 ,  H01L21/6835 ,  H01L23/481 ,  H01L24/05 ,  H01L27/1462 ,  H01L27/14636 ,  H01L27/1464 ,  H01L2221/68372 ,  H01L2224/05093 ,  H01L2924/01046 ,  H01L2924/01078

Abstract: A method for forming a pad in a wafer with a three-dimensional stacking structure includes: (a) a first process of bonding a device wafer and a handling wafer; (b) a second process of thinning a back side of an Si substrate which is formed on the device wafer, after the first process; (c) a third process of forming an anti-reflective layer and a PMD (preferential metal deposition) dielectric layer, after the second process; (d) a fourth process of forming vias on back sides of super contacts which are formed on the Si substrate, after the third process; and (e) a fifth process of forming a pad, after the fourth process.

Abstract translation: 用于在具有三维堆叠结构的晶片中形成焊盘的方法包括：（a）接合器件晶片和处理晶片的第一工艺; （b）在第一工序之后，使形成在器件晶片上的Si衬底的背面变薄的第二工序; （c）在第二工序之后形成抗反射层和PMD（优先金属沉积）介质层的第三工艺; （d）在第三工序之后在Si衬底上形成的超级触点的背面上形成通孔的第四工序; 和（e）在第四处理之后形成垫的第五工序。