公开(公告)号：US20160268373A1

公开(公告)日：2016-09-15

申请号：US15030347

申请日：2014-10-02

Applicant: SILICONFILE TECHNOLOGIES INC.

Inventor： Min Suk KO ,  Kyoung Sik PARK ,  Gab Hwan CHO ,  Heui Gyun AHN ,  Sang Wook AHN ,  Yong Woon LEE ,  Huy Chan JUNG

IPC: H01L29/06 ,  H01L27/146 ,  H01L23/373 ,  H01L23/367 ,  H01L23/467

CPC classification number: H01L29/0657 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/467 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor apparatus having a heat dissipating function and electronic equipment comprising the same includes a front surface on which semiconductor devices constituting a circuit a circuit are formed; and a rear surface including a convexo-concave surface. Thus, the heat dissipation effect of the semiconductor apparatus can be maximized even without attaching a heat dissipation plate thereto.

Abstract translation: 具有散热功能的半导体装置和包括该散热功能的电子设备包括形成有构成电路电路的半导体器件的正面; 以及包括凸凹表面的后表面。 因此，即使不附加散热板，也可以使半导体装置的散热效果最大化。