公开(公告)号：EP3189541B1

公开(公告)日：2020-12-09

申请号：EP15837255.7

申请日：2015-09-02

Applicant: Skorpios Technologies, Inc.

Inventor： LAMBERT, Damien ,  SPANN, John ,  KRASULICK, Stephen

IPC: H01L21/683 ,  G02B6/12

公开(公告)号：WO2016036874A1

公开(公告)日：2016-03-10

申请号：PCT/US2015/048176

申请日：2015-09-02

Applicant: SKORPIOS TECHNOLOGIES, INC.

Inventor： LAMBERT, Damien ,  SPANN, John ,  KRASULICK, Stephen

IPC: H01L21/60

CPC classification number: H01L21/6835 ,  G02B6/4201 ,  H01L21/0274 ,  H01L21/2007 ,  H01L21/683 ,  H01L21/76254 ,  H01L24/03 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L24/94 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/0362 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/80201 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2225/06593 ,  H01L2924/01014 ,  H01L2924/1032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15738

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

Abstract translation: 使用具有顺应性树脂的转印衬底将一个或多个芯片结合到目标晶片。 植入区域形成在转印衬底中。 转印衬底的一部分被蚀刻以形成提升器。 将合适的材料施加到转印基板上。 芯片被固定到柔性材料上，其中芯片被固定到提升管上方的柔性材料。 当芯片固定到顺应性材料时，芯片被结合到目标晶片。 从芯片上去除转印衬底和柔顺材料。 转印衬底对UV光是不透明的。

公开(公告)号：WO2015120260A1

公开(公告)日：2015-08-13

申请号：PCT/US2015/014801

申请日：2015-02-06

Applicant: SKORPIOS TECHNOLOGIES, INC.

Inventor： KUMAR, Nikhil ,  LI, Guoliang ,  KRASULICK, Stephen

IPC: H01P5/103

CPC classification number: G02B6/305

Abstract: A waveguide coupler has a compression region and an expansion region for coupling light between a silicon waveguide and an optical fiber. The compression region receives light from the silicon waveguide and compresses an optical mode of the light. Light is transmitted from the compression region to an expansion region. The expansion region expands the light to have a larger cross section. Light is then transmitted to the optical fiber.

Abstract translation: 波导耦合器具有用于在硅波导和光纤之间耦合光的压缩区域和扩展区域。 压缩区域接收来自硅波导的光并压缩光的光学模式。 光从压缩区域传输到扩展区域。 膨胀区域使光线扩展成具有较大的横截面。 光然后传输到光纤。

公开(公告)号：EP3189541A1

公开(公告)日：2017-07-12

申请号：EP15837255.7

申请日：2015-09-02

Applicant: Skorpios Technologies, Inc.

Inventor： LAMBERT, Damien ,  SPANN, John ,  KRASULICK, Stephen

IPC: H01L21/60

CPC classification number: H01L21/6835 ,  G02B6/4201 ,  H01L21/0274 ,  H01L21/2007 ,  H01L21/683 ,  H01L21/76254 ,  H01L24/03 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L24/94 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/0362 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/80201 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2225/06593 ,  H01L2924/01014 ,  H01L2924/1032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15738

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

Abstract translation: 使用具有柔性树脂的转移基板来将一个或多个芯片结合到目标晶圆。 注入区域形成在转移基板中。 转移衬底的一部分被蚀刻以形成立管。 合格的材料被施加到转印基材上。 芯片被固定到柔性材料，其中芯片被固定到立管上方的柔性材料。 当芯片被固定到柔性材料上时，芯片被结合到目标晶圆。 转移衬底和柔性材料从芯片上移除。 转印基材对UV光不透明。