Heat-stabilized and lightfast polyamides
    1.
    发明授权
    Heat-stabilized and lightfast polyamides 失效
    热稳定和轻质聚酰胺

    公开(公告)号:US3629174A

    公开(公告)日:1971-12-21

    申请号:US3629174D

    申请日:1970-02-25

    Applicant: SNIA VISCOSA

    CPC classification number: C08K5/02 C08L77/00

    Abstract: IN THE MANUFACTURE OF POLYAMIDES FOR INDUSTRIAL USES IN GENERAL, SUCH AS FOR THE PRODUCTION OF FIBERS, YARNS MOULDED ARTICLES AND THE LIKE, THE IMPROVEMENT IS HEREIN DISCLOSED, WHICH CONSISTS IN THE CONCURRENT ADDITION OF A STABILIZING COPPER COMPOUND AND OF AN ALLYL HALIDE, IN WHICH THE HYDROGEN ATOM OF THE DOUBLE-BONDED METHYLENE GROUPING IS POSSIBLY SUBSTITUTED BY AN ALIPHATIC RADICAL. ALLYL CHLORDE HAS PROVEN TO BE THE MOST ADVANTAGEOUS IN ITS CLAS. VERY SUPRISINGLY, THE PRESENCE OF AN ALLYL CHLORIDE AS DEFINED ABOVE HAS EXHIBITED AN UNPREDICTABLE ACTIVITY IN NUETRALIZING THE DISCOLOURATION WHICH WOULD BE OTHERWISE EXPERIENCED SHOULD THE COPPER COMPOUND BE USED ALONE. PRODUCTS HAVING AN OUTSTANDINGLY HIGH WHITENESS RATING HAVE BEEN THUS OBTAINED.

    3.
    发明专利
    未知

    公开(公告)号:DE2924024A1

    公开(公告)日:1979-12-20

    申请号:DE2924024

    申请日:1979-06-13

    Applicant: SNIA VISCOSA

    Abstract: A composition for increasing the light and heat stability of polyamides comprises a copper salt bound to a halogen atom and to a hydrosoluble organic compound. The organic compound is able to maintain the CuX compound or its complexes in solution in water up to about 60 DEG C.

    4.
    发明专利
    未知

    公开(公告)号:DE1435677B1

    公开(公告)日:1973-02-15

    申请号:DE1435677

    申请日:1964-03-12

    Applicant: SNIA VISCOSA

    Abstract: 1,019,099. Melt-spinning polyamides. SNIA VISCOSA SOC. NATURALE INDUSTRIA APPLICAZIONI VISCOSA S.p.A. March 10, 1964 [March 15, 1963], No. 10026/64. Heading B5B. In melt-spinning polyamides, the polymer chips, after having been dried, by heating in vacuo, are artificially cooled, or allowed to cool spontaneously, in an atmosphere of inert gas to a temperature not exceeding 50‹ C., and preferably between 25‹ and 30‹ C., before being transferred to the feed hopper of the melt-spinning apparatus, preferably while still surrounded by an atmosphere of the inert gas. The chips may be artificially cooled or allowed to cool spontaneously in the apparatus in which they have been dried in vacuo, a dry inert gas such as dry nitrogen having been introduced into the drying chamber until the interior of the latter is at atmospheric pressure and cold water being circulated through the jacket of the drying chamber (which may be rotated to tumble the chips) until they have been cooled to the desired temperature. Alternatively the chips may be cooled, while they are being mechanically conveyed from the drier to the melt-spinning apparatus, by contacting them with a stream of a cooled dry inert gas such as dry nitrogen. In either case the initial humidity of the inert gas may be so controlled so that it does not exceed a predetermined level, such as 70 milligrams of moisture per cubic metre of gas. In a third method the hot dry chips are discharged from the drying chamber on to a hollow horizontal metallic plate through the interior of which flows a stream of cold water. The plate is enclosed in a chamber through which flows a stream of dry nitrogen and the polymer chips are caused to travel along the entire length of the plate by vibrating the plate. The cooled chips are discharged into a duct through which they are pneumatically conveyed to the melting apparatus by a current of dry nitrogen.

    6.
    发明专利
    未知

    公开(公告)号:RO78150A

    公开(公告)日:1982-04-12

    申请号:RO9786579

    申请日:1979-06-15

    Applicant: SNIA VISCOSA

    Abstract: A composition for increasing the light and heat stability of polyamides comprises a copper salt bound to a halogen atom and to a hydrosoluble organic compound. The organic compound is able to maintain the CuX compound or its complexes in solution in water up to about 60 DEG C.

    7.
    发明专利
    未知

    公开(公告)号:PL216358A1

    公开(公告)日:1980-03-24

    申请号:PL21635879

    申请日:1979-06-15

    Applicant: SNIA VISCOSA

    Abstract: A composition for increasing the light and heat stability of polyamides comprises a copper salt bound to a halogen atom and to a hydrosoluble organic compound. The organic compound is able to maintain the CuX compound or its complexes in solution in water up to about 60 DEG C.

    9.
    发明专利
    未知

    公开(公告)号:DE1435682A1

    公开(公告)日:1969-03-20

    申请号:DE1435682

    申请日:1964-04-17

    Applicant: SNIA VISCOSA

    Abstract: 1,034,401. Melt-spinning. SNIA VISCOSA SOC. NAZIONALE INDUSTRIA APPLICAZIONI VISCOSA S.p.A. April 13, 1964 [April 17, 1963], No. 15110/64. Heading B5B. Filaments of linear synthetic polymers are melt-extruded into a gaseous enclosure containing steam at 30‹-200‹ C., forwarded in such a way that they are in contact with the steam for at least 1 second, e.g. 1 to 6 seconds, then passed through a heated space in which every part of the yarn remains for at least 1 second, e.g. 1 to 6 seconds, and finally stretched. The steam treatment may be carried out in presence of air. the proportions of steam and air being such that the air has a relative moisture of at least 85%. The heated space may be a tubular passageway maintained at 20-95‹ C., and the stretching may be effected in one or more stages to a total draw ratio of 1: 4-5. Specified polymers are polyesters, e.g. polyethylene terephthalate, and nylons, e.g. polycaproamide. In one embodiment (not shown) filaments 18 extruded from spinneret 10 into an enclosure 11 are treated with a mixture of air (from fan 14) and steam (from perforated pipe 13) passing through perforated wall 17. The steam-treated filaments are then passed through tube 19 heated by jacket 20, stretched in two stages by pairs of skew cylinders 21, 22, 23 and wound up at 26. The yarns may have a tenacity of 5-9 g./den.

    10.
    发明专利
    未知

    公开(公告)号:IT1096743B

    公开(公告)日:1985-08-26

    申请号:IT2458578

    申请日:1978-06-15

    Applicant: SNIA VISCOSA

    Abstract: A composition for increasing the light and heat stability of polyamides comprises a copper salt bound to a halogen atom and to a hydrosoluble organic compound. The organic compound is able to maintain the CuX compound or its complexes in solution in water up to about 60 DEG C.

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