LAYOUT METHOD OF INTEGRATED CIRCUIT

    公开(公告)号:JPH08166977A

    公开(公告)日:1996-06-25

    申请号:JP31013394

    申请日:1994-12-14

    Applicant: SONY CORP

    Abstract: PURPOSE: To provide a layout method whereby a chip is fully automatically generated, a development cost is remarkably reduced and a design period is extremely shortened. CONSTITUTION: At the time of the layout of a CCD imager, a template 1 having information concerning the definition of regularity in structure, a leaf cell 2 having information concerning the min. unit of structure and a personality file 3 having information concerning the repetition of structure including coordinate information to be reference are previously prepared at first. Then, the layout at each layer is generated by a core compiler 4 based on respective pieces of input information of those files and also the cells 5a-5c of the respective layers of a CCD core 5 and a bonding pad cell 6 are superimposed by a structure accumulator 7 based on coordinate information stored in the file 3. Then, an element separation well is generated in a well compiler 8 and a CCD core terminal is connected to a bonding pad by a route compiler 9.

    SOLID-STATE IMAGE SENSOR
    2.
    发明专利

    公开(公告)号:JPH0434977A

    公开(公告)日:1992-02-05

    申请号:JP13963390

    申请日:1990-05-31

    Applicant: SONY CORP

    Abstract: PURPOSE:To notably lower the flare level by focusing an incident light on a reflection preventive film in an optical black part. CONSTITUTION:A beam of light Po supposed to enter through the intermediary of a seal glass 7 enters in a focusing lenses 6 on an optical black part (OPB). The beam of light Po is reflected at the interface of the focusing lenses 6 to advance toward a dyeing layer 5. Since this dyeing layer 5 functions as a reflection preventive film, the reflected light P1 is dimmed with the dyeing layer 5 so that the intensity of the reflected light P2 from the dyeing layer 5 may satisfactorily be decreased. Accordingly, the reflection of the light focused on the focusing lenses 6 can be avoided thereby enabling the flare level to be satisfactorily lowered.

    MANUFACTURING METHOD OF SOLID IMAGING DEVICE

    公开(公告)号:JP2003249640A

    公开(公告)日:2003-09-05

    申请号:JP2002046527

    申请日:2002-02-22

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To manufacture a solid imaging device having an exposure area larger than summarized exposure range of an aligned, inexpensively with a high accuracy. SOLUTION: The whole exposure area of an imaging device 10 is divided into three sections of a pickup section, a left side peripheral circuit section and a right side peripheral circuit section. Then, in the initial exposure process, a first imaging section 20 comprising a main scale becoming the reference of a pattern mating mark 40B and a deviation of mating detecting mark 40A is formed. After the next exposure process, the exposure of the imaging section 20 after second exposure and the formation of respective marks 40A, 40B are effected based on the references of respective marks 40A, 40B formed in the first imaging section 20. Thereafter, the exposure of the left side area 310 and the right side area 320 of the peripheral circuit section 30 is effected sequentially. In this case, wafers aligned with the longitudinal summarized exposure range of the aligner are turned by 90° and the left side area 310 as well as the right side area 320 of the peripheral circuit section 30 are aligned longitudinally to effect the exposure. COPYRIGHT: (C)2003,JPO

    DRIVING METHOD FOR SOLID-STATE IMAGE PICKUP DEVICE

    公开(公告)号:JPH06153080A

    公开(公告)日:1994-05-31

    申请号:JP32234792

    申请日:1992-11-06

    Applicant: SONY CORP

    Abstract: PURPOSE:To improve a charge transfer performance by varying substrate voltage. CONSTITUTION:In a solid-state image pickup device in a frame transfer system, substrate voltage Vse in a period Te excepting for a light receiving period is set to be lower than substrate voltage Vsb in the pertient light receiving period Tb and drive it. On the other hand, in a solid-state image pickup device in a frame inter-line transfer system, substrate voltage Vst in a transfer period Tt in a photosensor part is set to be lower than substrate voltage Vs in the light receiving period Tb and drive it.

    SOLID STATE IMAGE PICKUP ELEMENT
    5.
    发明专利

    公开(公告)号:JPH0832043A

    公开(公告)日:1996-02-02

    申请号:JP18291994

    申请日:1994-07-12

    Applicant: SONY CORP

    Abstract: PURPOSE:To enable eliminating false signal, by constituting each lens element of an on-chip lens in a form wherein lights received at optical sampling points of a constant pitch are converged on the photo-detection element of a picture element corresponding with self. CONSTITUTION:The base part of the trapezoid of a lens element 7 on the left end is constituted as a rectangle wherein the left side is a long side and the right is a short side. The second lens 7 from the left end has a long side and a short side of inverted relation. A lens element 7 on the right end is identical to the second lens element from the left end. Other parts also are formed so as to have the same regularity. When the base part of each of the lens elements 7, 7... is constituted as a rectangle, a dome convex spherical surface is formed. When the arrangement pitches of picture elements 1, 1... in the horizontal direction are made uniform, the light received by a photo detection element constituting an element 1 corresponding with self can be converged, and false signal can be effectively eliminated.

    SOLID-STATE IMAGE PICKUP ELEMENT
    6.
    发明专利

    公开(公告)号:JPH04294583A

    公开(公告)日:1992-10-19

    申请号:JP8313291

    申请日:1991-03-23

    Applicant: SONY CORP

    Abstract: PURPOSE:To form a dyed layer for preventing reflection which can effectively prevent the occurrence of flares caused by the light reflected by a light shielding film and, at the same time, to make the shape of the lens element of a solid- state image pickup element provided with an on-chip lens element easily controllable so that the light condensing property of the lens element can be improved. CONSTITUTION:A dyed layer 9 for preventing reflection is formed in a grid-like shape when the layer 9 is viewed from the top and openings 12, 12,... formed by the layer 9 are positioned above each photoreceptor element 3, 3,.... Therefore, the light reflected by a light shielding film 7 between adjacent picture elements in both of the horizontal and vertical directions can be absorbed and the occurrence of flares can be effectively prevented. In addition, the layer 9 also works as the base of on-chip lens elements 11, 11,... and supports the elements 11, 11,... having a rectangular planar shape from the four sides. Therefore, the sensitivity of this solid-state image pickup element can be improved and the occurrence of flares can be reduced further, since each lens element 11 can be easily shaped and the light condensing property of the film 7 to the openings 8 is improved.

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