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公开(公告)号:DE602005000371T2
公开(公告)日:2007-10-18
申请号:DE602005000371
申请日:2005-04-22
Applicant: SONY CORP
Inventor: TAKASHIMA KOUICHIRO , MIYAJIMA YOICHI , TAKAHASHI YOSHITAKE , TAKAHASHI NOBUTATSU , NOGO YUICHIRO , MIYAMORI KIYOSHI , IIDA MASAYOSHI , EBINE NOBUHITO
Abstract: The invention aims at miniaturizing electronic devices and accessory devices. A connector on an electronic device includes a pair of locking plates, a guide groove, and a space. Each locking plate has, on its edge, a first concave portion, a first convex portion, a second concave portion, and a second convex portion. An intermediate surface for determining a position of an accessory device below the guide groove is provided below the second concave portions and the second convex portions. A contact mounting surface provided with plural contacts is provided below the first convex portions. Guide surfaces for determining a position of the accessory device in the width direction of the guide groove are provided below the first concave portions and the first convex portions.
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公开(公告)号:MY140755A
公开(公告)日:2010-01-15
申请号:MYPI20051861
申请日:2005-04-27
Applicant: SONY CORP
Inventor: TAKASHIMA KOUICHIRO , MIYAJIMA YOICHI , TAKAHASHI YOSHITAKE , TAKAHASHI NOBUTATSU , NOGO YUICHIRO , MIYAMORI KIYOSHI , IIDA MASAYOSHI , EBINE NOBUHITO
IPC: H04N5/225
Abstract: THE INVENTION AIMS AT MINIATURIZING ELECTRONIC THE INVENTION AIMS AT MINIATURIZING ELECTRONIC DEVICES AND ACCESSORY DEVICES. A CONNECTOR ON ELECTRONIC DEVICE (100) INCLUDES A PAIR OF LOCKING PLATES (20), A GUIDE GROOVE (18), AND A SPACE (22). EACH LOCKING PLATE HAS, ON ITS EDGE, A FIRST CONCAVE PORTION (2002), A FIRST CONVEX PORTION (2004), A SECOND CONCAVE PORTION (2006), AND A SECOND CONVEX PORTION (2008). AN INTERMEDIATE SURFACE FOR DETERMINING A POSITION OF AN ACCESSORY DEVICE (200) BELOW THE GUIDE GROOVE (18) IS PROVIDED BELOW THE SECOND CONCAVE PORTIONS (2006) AND THE SECOND CONVEX PORTIONS (2008). A CONTACT MOUNTING SURFACE (1206, 56) PROVIDED WITH PLURAL CONTACTS (16, 48) IS PROVIDED BELOW THE FIRST CONVEX PORTIONS (2004). GUIDE SURFACES FOR DETERMINING A POSITION OF THE ACCESSORY DEVICE (200) IN THE WIDTH DIRECTION OF THE GUIDE GROOVE (18) ARE PROVIDED BELOW THE FIRST CONCAVE PORTIONS (2002) AND THE FIRST CONVEX PORTIONS (2004).
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公开(公告)号:DE602005000371D1
公开(公告)日:2007-02-08
申请号:DE602005000371
申请日:2005-04-22
Applicant: SONY CORP
Inventor: TAKASHIMA KOUICHIRO , MIYAJIMA YOICHI , TAKAHASHI YOSHITAKE , TAKAHASHI NOBUTATSU , NOGO YUICHIRO , MIYAMORI KIYOSHI , IIDA MASAYOSHI , EBINE NOBUHITO
Abstract: The invention aims at miniaturizing electronic devices and accessory devices. A connector on an electronic device includes a pair of locking plates, a guide groove, and a space. Each locking plate has, on its edge, a first concave portion, a first convex portion, a second concave portion, and a second convex portion. An intermediate surface for determining a position of an accessory device below the guide groove is provided below the second concave portions and the second convex portions. A contact mounting surface provided with plural contacts is provided below the first convex portions. Guide surfaces for determining a position of the accessory device in the width direction of the guide groove are provided below the first concave portions and the first convex portions.
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公开(公告)号:JP2006079053A
公开(公告)日:2006-03-23
申请号:JP2005093897
申请日:2005-03-29
Inventor: TAKASHIMA KOICHIRO , MIYAJIMA YOICHI , TAKAHASHI YOSHITAKE , TAKAHASHI NOBUTATSU , NOGO YUUICHIROU , MIYAMORI KIYOSHI , IIDA MASAYOSHI , EBINE NOBUHITO
Abstract: PROBLEM TO BE SOLVED: To aim at miniaturizing electronic devices and accessory devices. SOLUTION: A connector 10 on the electronic device side of an electronic device 100 includes a pair of locking plates 20, a guide groove 18 and a space part 22. Each locking plate has, on its edge, a first concave portion 2002, a first convex portion 2004, a second concave portion 2006 and a second convex portion 2008. An intermediate surface 1207 for determining a position of an accessory device 200 below the guide groove 18 is provided below the second concave portions 2006 and the second convex portions 2008. A contact mounting surface 1206 is provided below the first convex portions 2004 and a plurality of contacts 16 are provided on the contact mounting surface 1206. Guide surfaces 24 on the connector side for determining a position of the accessory device 200 in the width direction of the guide groove 18 are provided below the first concave portions 2002 and the first convex portions 2004. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题:旨在使电子设备和附件设备小型化。 解决方案:电子设备100的电子设备侧的连接器10包括一对锁定板20,引导槽18和空间部分22.每个锁定板在其边缘上具有第一凹部2002 第一凸部2004,第二凹部2006和第二凸部2008.在第二凹部2006的下方设置有用于确定辅助装置200在引导槽18下方的位置的中间面1207,第二凸部 在第一凸部2004的下方设置有接触安装面1206,在接触安装面1206上设置有多个触头16.连接器侧的导向面24用于确定附件装置200的宽度方向的位置 引导槽18设置在第一凹部2002和第一凸部2004的下方。版权所有(C)2006,JPO&NCIPI
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公开(公告)号:JP2003059214A
公开(公告)日:2003-02-28
申请号:JP2001241104
申请日:2001-08-08
Applicant: Nippon Keiki Works Ltd , Sony Corp , ソニー株式会社 , 株式会社日本計器製作所
Inventor: KAYAMA TAKASHI , KATAOKA YASUHIRO , IIDA MASAYOSHI , SHINOSAWA HIDETOSHI
IPC: G11B21/02
Abstract: PROBLEM TO BE SOLVED: To provide a head actuator that can be downsized for preparation of turning a magnetic head and an arm by a prescribed angle, and to provide a magnetic recording and reproducing device.
SOLUTION: A rotor 40 includes a rotor yoke 56 integrally structured with the arm 20 and a coil 60 integrally structured with the rotor yoke 56 and placed while facing a drive magnet around a shaft, the coil 60 is formed triangle around the shaft and connected to a power application control section that turns the rotor 40 with respect to a stator 43 within a range of a prescribed angle θ by selecting the direction of power application to the coil 60 in a first direction or a 2nd direction opposite to the first direction.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题:提供一种头部致动器,其可以缩小尺寸以准备将磁头和臂转动指定角度,并提供磁记录和再现装置。 解决方案:转子40包括与臂20一体地构成的转子轭铁56和与转子轭铁56一体地构成并与轴相对的驱动磁体一体地配置的线圈60,线圈60围绕轴形成为三角形并与 功率施加控制部,其通过在与第一方向相反的第一方向或第二方向上选择向线圈60施加的功率的方向,将转子40相对于定子43转动到规定角度θ的范围内。
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公开(公告)号:JP2000057291A
公开(公告)日:2000-02-25
申请号:JP22680698
申请日:1998-08-11
Applicant: SONY CORP
Inventor: OZEKI MINORU , HAKUTA TATSUO , IIDA MASAYOSHI , MIYAI SEIICHI
IPC: B42D15/10 , G06K19/07 , G06K19/077
Abstract: PROBLEM TO BE SOLVED: To eliminate the need of using a polyimide film having heat resistance by inserting a bump into a hole from the rear face side of a polyester film, charging a conductive adhesive into the hole from its surface side, heating and drying the adhesive at a low temperature. SOLUTION: A wiring electrode 17 is connected to one edge or the other edge of an antenna pattern formed on the surface of a polyester film sheet 11. A through hole part 19 whose diameter is almost equal to that of a bump 13 of an IC 15 is formed in the electrode 17 and the film sheet 11. The IC 15 is arranged on the rear face of the film sheet 11 and the bump 13 is inserted into the hole part 19. Conductive adhesive 21 is charged into the hole part 19 on the surface side of the film sheet 11 and the adhesive 21 is dried at a prescribed temperature. Thus, the bump 13 and the wiring electrode 17 are connected to each other by using the conductive adhesive 21 capable of bonding them without being heated to the temp. that the sheet 11 can resist.
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公开(公告)号:JPH1013001A
公开(公告)日:1998-01-16
申请号:JP18417196
申请日:1996-06-25
Applicant: SONY CORP
Inventor: IIDA MASAYOSHI
Abstract: PROBLEM TO BE SOLVED: To achieve a wiring board for improving adhesion with adhesive resin. SOLUTION: An adhesion reinforcing layer 18B that has a higher adhesion for an adhesive resin 17 than an insulation substrate 11 and has an area for obtaining a desired adhesion between the insulation substrate 11 and the adhesive resin 17 is provided at a region that opposes the circuit surface of electronic parts 12 and 14 on one surface of at least the insulation substrate 11, thus increasing a region with high adhesive for the adhesive resin 17 than the insulation substrate 11 by the adhesion reinforcing layer 18B on one surface 11A of the insulation substrate 11 and hence achieving a wiring board 10 for improving the adhesion with the adhesive resin.
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公开(公告)号:JPH08288695A
公开(公告)日:1996-11-01
申请号:JP9378895
申请日:1995-04-19
Applicant: SONY CORP
Inventor: IIDA MASAYOSHI
Abstract: PURPOSE: To provide a method and an apparatus for mounting a chip component in which the mounting position coordinates of the component can be corrected by calculating the change amount of the profile size of a printed circuit board. CONSTITUTION: The method for mounting a chip component comprises the steps of inputting the mounting position coordinates of the component by an inputting unit 27, reading the recognition mark on the board by a reader 28, calculating the deviation of the mark by a calculator 29, calculating the corrected value of the mounting coordinates by a calculator 30, correcting the coordinates by a corrector 31, and mounting the components by a mounting unit 32. Accordingly, even if the profile size of the board is irregular, the component can be correctly mounted at a mounting land.
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公开(公告)号:JPH07335992A
公开(公告)日:1995-12-22
申请号:JP15414694
申请日:1994-06-13
Applicant: SONY CORP
Inventor: IIDA MASAYOSHI
Abstract: PURPOSE:To provide a an interconnection board capable of a high density package at a low cost and production process of the board. CONSTITUTION:An interconnection board 1 for electrically connecting electronic parts 4 having first bump electrodes 5 comprises bump electrode holders 2 to house second bump electrodes 3 and electrodes 16 disposed in the holders 2. The electrodes 16 are connected to the electrodes 5 of the electronic parts 4 through the 2nd electrodes housed in bump electrode holders 7.
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公开(公告)号:JP2005116495A
公开(公告)日:2005-04-28
申请号:JP2003386173
申请日:2003-11-17
Applicant: Molex Japan Co Ltd , Sony Corp , ソニー株式会社 , 日本モレックス株式会社
Inventor: KAYAMA TAKASHI , SHIMIZU YUKIKO , IIDA MASAYOSHI , YAMAGUCHI TOMISABURO , KOKUSHI SHINSUKE , ASO AKIRA
CPC classification number: H01R12/772 , H01R12/79 , H01R12/88
Abstract: PROBLEM TO BE SOLVED: To realize sure connection between a flat cable and a connector to realize a fine pitch.
SOLUTION: This connector 1 is equipped with: a body part 10 for inserting a tip of the flat cable 2; a movable pressing member 11 for pressing and fixing the flat cable 2 in the state where the flat cable 2 is inserted in the body part 10; and projecting parts 13 formed on the body part 10 or the pressing member 11 and fitted to holes 23 of the flat cable 2 with the tip of the flat cable 2 inserted into a normal position. The flat cable 2 is equipped with: a flexible base material 21 having flexibility; wiring 22 formed on the flexible base material 21; and the holes 23 fitted to the projecting parts 13 formed on the connector 1 with the flexible base material 21 inserted in the normal position of the connector 1.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题:实现扁平电缆和连接器之间的确实连接以实现精细的间距。 解决方案:该连接器1装备有:用于插入扁平电缆2的尖端的主体部分10; 在扁平电缆2插入本体部10的状态下按压固定扁平电缆2的可动按压部件11; 以及形成在主体部分10或按压部件11上的突出部分13,并且将扁平电缆2的前端插入到正常位置,并将其装配到扁平电缆2的孔23中。 扁平电缆2配备有:具有柔性的柔性基材21; 在柔性基材21上形成的布线22; 以及安装到形成在连接器1上的突出部13的孔23,其中柔性基材21插入连接器1的正常位置。版权所有(C)2005,JPO&NCIPI
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